Consolidation Hits OSAT Biz

The outsourced semiconductor assembly and test (OSAT) industry is undergoing a new wave of acquisition activity that will dramatically reshape the packaging and test services markets. [getkc id="83" kc_name="OSATs"] have seen a considerable amount of consolidation over the years, but the industry needs a scorecard to keep track of the recent deals and the resulting fallout. One OSAT deal inv... » read more

Fan-Out Packaging Gains Steam

Fan-outs are creating a buzz and gaining steam in the market at a pace far beyond what anyone would have expected even at the start of the year. The approach, which has been around for several years, is a wafer-level packaging process that enables ultra-thin, high-density packages. So why the buzz? Apple is apparently moving to [getkc id="202" kc_name="fan-out"] packaging, according to an... » read more

The Week In Review: Manufacturing

For years, Altera’s sole foundry was TSMC. Then, not long ago, Altera selected Intel as its foundry partner for 14nm. TSMC still handles 20nm and above work for Altera. This quarter, Altera was supposed to select a foundry partner for 10nm. This week, Altera posted lackluster results in the quarter. Altera did not elaborate on its 10nm plans, nor did it discuss the Intel rumors. "Altera did n... » read more

Manufacturing Bits: April 21

Fan-out packaging consortium A*STAR’s Institute of Microelectronics (IME) and others have formed a high-density fan-out wafer level packaging (FOWLP) consortium in Singapore. Others in the group include Amkor, Nanium, STATS ChipPAC, NXP, GlobalFoundries, Kulicke & Soffa, Applied Materials, Dipsol Chemicals, JSR, KLA-Tencor, Kingyoup Optronics, Orbotech and Tokyo Ohka Kogyo (TOK). T... » read more

Semicon West Preview: Packaging

By Paula Doe The evolving mobile device market means the packaging, assembly and test supply chain faces a growing range of alternative technologies vying for its investment dollar, everything from Google’s modular electronics with 3D printing, to more solutions for integrating varied chips in smaller packaged systems. One potentially disruptive change is the wider use of more open-source... » read more