Challenges Grow For IP Reuse


As chip complexity increases, so does the complexity of IP blocks being developed for those designs. That is making it much more difficult to re-use IP from one design to the next, or even to integrate new IP into an SoC. What is changing is the perception that standard [getkc id="43" kc_name="IP"] works the same in every design. Moreover, well-developed [getkc id="100" kc_name="methodologie... » read more

The Week In Review: Design


Legal Synopsys filed suit against Ubiquiti Networks and its project leader for "circumventing technological measures that effectively control access to Synopsys' software." The suit, filed in U.S. District Court in San Jose, claims that Ubiquiti used counterfeit keys obtained or created with tools from hacker websites to circumvent Synopsys' License Key system. Ubiquiti, based in San Jose, d... » read more

What Does An AI Chip Look Like?


Depending upon your point of reference, artificial intelligence will be the next big thing or it will play a major role in all of the next big things. This explains the frenzy of activity in this sector over the past 18 months. Big companies are paying billions of dollars to acquire startup companies, and even more for R&D. In addition, governments around the globe are pouring additional... » read more

Embedded FPGAs Come Of Age


FPGAs increasingly are being viewed as a critical component in heterogeneous designs, ratcheting up their stature and the amount of attention being given to programmable devices. Once relegated to test chips that ultimately would be replaced by lower-power and higher-performance ASICs if volumes were sufficient, FPGAs have come a long way. Over the last 20 years programmable devices have mov... » read more

Custom Hardware Thriving


In the early days of the IoT, predictions about the commoditization of hardware and the end of customized hardware were everywhere. Several years later, those predictions are being proven wrong. Off-the-shelf components have not replaced customized hardware, and software has not dictated all designs. In fact, in many cases the exact opposite has happened. And where software does play an elev... » read more

Chip-Package-Board Issues Grow


As systems migrate from a single die in a single package on a board, to multiple dies with multiple packaging options and multiple PCB form factors, it is becoming critical to move system planning, assembly, and optimization much earlier in the design-through-manufacturing flow. This is easier said than done. Multiple tools and operating systems are now used at each phase of the flow, partic... » read more

Software Modeling Goes Mainstream


Software modeling is finally beginning to catch on across a wide swath of chipmakers as they look beyond device scaling to improve performance, lower power, and ratchet up security. Software modeling in the semiconductor industry historically has been associated with hardware-software co-design, which has grown in fits and starts since the late 1990s. The largest chipmakers and systems compa... » read more

Hybrid Simulation Picks Up Steam


As electronic products shift from hardware-centric to software-directed, design teams are relying increasingly on a simulation approach that includes multiple engines—and different ways to use those engines—to encompass as much of the system as possible. How engineers go about using these approaches, and even how they define them, varies greatly from one company to the next. Sometimes it... » read more

Overcoming The Limits Of Scaling


Semiconductor Engineering sat down to discuss the increasing reliance on architectural choices for improvements in power, performance and area, with [getperson id="11425" comment=" Sundari Mitra"], CEO of [getentity id="22535" comment="NetSpeed Systems"]; Charlie Janac, chairman and CEO of [getentity id="22674" e_name="Arteris"]; [getperson id="11032" comment="Simon Davidmann"] CEO of [getentit... » read more

Architect Specs Harder To Follow


Interpreting and implementing architects' specifications is getting harder at each new process node, which is creating problems throughout the design flow, into manufacturing, and sometimes even post-production. Rising complexity and difficulties in scaling have pushed much more of the burden onto architects to deal with everything from complex power schemes, new packaging approaches, and to... » read more

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