tag: NextFlex

Additive Techniques For Flexible Hybrid Electronics Packaging And Integration With Human Body
By Gity Samadi - 20 Oct, 2022 - Comments: 0

By Gity Samadi and Paul Semenza Flexible hybrid electronics (FHE) has spawned the development of novel packaging techniques to overcome the application limitations of the rigid boards, high-temperature solders, bulky component packages, and insertion processes used in traditional printed circuit boards. Thin, flexible substrates, bare die, and combinations of printed and small-format package... » read more

Startup Funding: February 2022
By Jesse Allen - 07 Mar, 2022 - Comments: 0

Mega-rounds dominated venture funding in February, with ten companies seeing investment of $100 million or more, five of which exceeded $200 million. Automotive was the big winner, with seven of the ten companies involved in either developing ADAS and autonomous driving, building electric vehicles, or making components to go in cars. The largest round of the month falls into that last category,... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 25 Feb, 2022 - Comments: 0

Chipmakers, OEMs UMC plans to build a new fab next to its existing 300mm fab in Singapore. The new fab, called Fab12i P3, will manufacture wafers based on UMC’s 22nm/28nm processes. The planned investment for this project will be $5 billion. The first phase of this greenfield fab will have a monthly capacity of 30,000 wafers with production expected to commence in late 2024. To account fo... » read more

Expanding Advanced Packaging Production In The U.S.
By Mark LaPedus - 05 Jan, 2022 - Comments: 0

The United States is taking the first steps toward bringing larger-scale IC packaging production capabilities back to the U.S. as supply chain concerns and trade tensions grow. The U.S. is among the leaders in developing packages, especially new and advanced forms of the technology that promise to shake up the semiconductor landscape. And while the U.S. has several packaging vendors, North A... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 19 Feb, 2021 - Comments: 0

Chipmakers and OEMs A severe winter storm has hit many parts of the United States, including Texas. In Austin, utility providers are prioritizing service to residential areas. As a result, electricity and natural gas providers have temporarily suspended service to Austin’s semiconductor manufacturers, including Samsung and NXP. "Due to the recent blackouts in Texas, Samsung Austin Semicon... » read more

The Good, Bad And Unknowns Of Flexible Devices
By Ed Sperling - 27 Jan, 2021 - Comments: 0

Flexible hybrid electronics are beginning to proliferate in consumer, medical, and industrial applications due to their comparatively low weight, thin profile, and the ability to literally bend the rules of design. Open any smart phone today and you're likely to find one or more of these flexible boards. Unlike standard printed circuit boards, FHE devices are printed using a combination of r... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 12 Jun, 2020 - Comments: 0

Chipmakers Jim Keller, senior vice president in the Technology, Systems Architecture and Client Group (TSCG) and general manager of the Silicon Engineering Group (SEG) at Intel, has resigned amid a major reorganization at the company. Here's one report about the situation. Cree as well as China’s Yutong Group and StarPower are working together to accelerate the commercial adoption of sili... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 01 May, 2020 - Comments: 0

Fab tools The U.S. Department of Commerce has announced new export control actions to prevent China, Russia, and Venezuela from obtaining U.S. technology for military purposes. This expands the “Military End Use/User Controls (MEU)” license requirement controls on China, Russia, and Venezuela, covering military end-users, as well as semiconductor equipment, sensors and other technologies. ... » read more

Challenges In Printed And Disposable Chips
By Susan Rambo And Ed Sperling - 05 Mar, 2020 - Comments: 0

Printing inexpensive chips using technology developed for newspapers and magazines is gaining traction across a wide range of applications, from photovoltaic cells to sensors on a flexible substrate. But it's also adding a slew of new challenges that are unique to this approach. The world of flexible hybrid electronics (FHE) — printing integrated circuits on or attaching thin IC chips to a... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 28 Feb, 2020 - Comments: 0

AI/Edge The United States Department of Defense (DOD) has adopted ethical principles for using artificial intelligence in warfare that chiefly say the U.S. has to follow the laws, treaties, in use of AI in warfare. Any AI used by DOD has to be responsible, equitable, traceable, reliable and governable. “The Department will design and engineer AI capabilities to fulfill their intended functio... » read more

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