Finding Defects Is Getting Harder

Chipmakers are plotting out a strategy to scale the transistor to 10nm and beyond. Migrating to these nodes presents a number of challenges, but one issue is starting to gain more attention in the market—killer defects. Defects have always been problematic in the yield ramp for chip designs, but the ability to find them is becoming more difficult and expensive at each node. And it will be... » read more

The Week In Review: Manufacturing

NuFlare Technology wants to enter a new market. The e-beam giant and NGR are jointly collaborating on a development program for next-generation electron-beam wafer inspection and metrology. It’s unclear if NuFlare is developing a single- or multi-beam tool, however. Don’t look now, but a fab tool downturn could be on the horizon. This comes amid a slowdown in PCs, tablets and smartphone... » read more