The Week In Review: Manufacturing


Chipmakers IC Insights has released its rankings of the top 10 pure-play foundries in 2016. TSMC was the largest foundry in terms of sales, followed by GlobalFoundries, UMC, and SMIC, according to IC Insights. TSMC held a 59% share in 2016. According to IC Insights, the three top-10 pure-play foundry companies that displayed the highest growth rates in 2016 were X-Fab (54%), SMIC (31%) and To... » read more

The Week In Review: IoT


R&D National Instruments this week opened the NI Industrial Internet of Things Lab at its headquarters in Austin, Texas. NI and Real-Time Innovations are co-leading the Industrial Internet Consortium’s Industrial Internet of Things Microgrid Testbed, which will be hosted at the NI Industrial Internet of Things Lab. The testbed uses the Data Distribution Service standard and is working to dev... » read more

The Week In Review: Manufacturing


Chipmakers and OEMs Samsung NEXT, formerly called the Samsung Global Innovation Center, has announced the creation of the Samsung NEXT Fund, a $150 million venture capital investment fund. The idea is to fund early stage startups. What’s next in consumer electronics? At CES 2017, Samsung unveiled a wide range of new products, such as quantum dot TVs, smart appliances, gaming laptops and s... » read more

The Week In Review: Manufacturing


Chipmakers TDK has agreed to acquire MEMS supplier InvenSense for cash at an acquisition price of $13.00 per share, for a total acquisition price of $1.3 billion. Cypress has begun volume shipments of microcontrollers (MCUs) based on its 40nm Embedded Charge-Trap (eCT) flash technology. The MCUs are made on a foundry basis at UMC. UMC’s technology is a 40nm low power (40LP) logic process.... » read more

Software Platforms Bridge The Design/Verification Gap For 5G Communications Design


We are entering the third phase of information connectivity, one that will change the use of wireless technology dramatically. The first phase connected homes and businesses through wired telephony and the early internet via dial-up modems. Over the last few decades, the development of communication networks has been superseded by wireless mobile technology connecting people instead of places. ... » read more

A Product Development Flow For 5G/LTE Envelope Tracking Power Amplifiers


Next-generation communication systems will rely on system architectures that will challenge component level design. This NI AWR software white paper examines the use of envelope tracking (ET), digital pre-distortion, and impedance matching via load pull to improve the efficiency and linearity performance of RF PAs targeting 4G and 5G applications. To read more, click here. » read more

The Week In Review: Manufacturing


Samsung Austin Semiconductor plans to invest more than $1 billion in its fab in Austin, Texas. Today, the fab continues to ramp up the company’s 14nm finFET technology. At the same time, Samsung is expanding its advanced finFET foundry process technology offerings with its fourth-generation 14nm process (14LPU) and its third-generation 10nm technology (10LPU). Graphcore is developing a so-... » read more

The Week In Review: Manufacturing


Chipmakers As expected, Qualcomm has signed a definitive agreement to acquire NXP. The value of the deal is approximately $47 billion. With the deal, Qualcomm is diversifying from a maturing handset market into the growing automotive, IoT and security sectors, according to Genuity semiconductor analyst Matthew Ramsay, in a recent research note. “Automotive infotainment, ADAS, IoT and ot... » read more

The Week In Review: Manufacturing


Fab tools and materials After a series of delays due to regulatory issues, Lam Research and KLA-Tencor have agreed to terminate their proposed merger agreement. Amid a possible proxy battle, Kulicke & Soffa Industries has named Fusen Chen as president and chief executive, effective Oct. 31. He was also elected to the board of K&S. Jonathan Chou, chief financial officer and interim CEO, w... » read more

The Week In Review: Manufacturing


Chipmakers The finFET market is heating up. GlobalFoundries, Intel, Samsung and TSMC are ramping 16nm/14nm finFETs. And 10nm and 7nm finFETs are in the works. The market will shortly have a new competitor—Taiwan’s United Microelectronics Corp. (UMC). Some years ago, UMC licensed finFET technology from IBM. UMC has been a bit quiet about the 14nm finFET technology, but it has made si... » read more

← Older posts