IC Test And Quality Requirements Drive New Collaboration


Rapidly increasing chip and package complexity, coupled with an incessant demand for more reliability, has triggered a frenzy of alliances and working relationships that are starting to redefine how chips are tested and monitored. At the core of this shift is a growing recognition that no company can do everything, and that to work together will require much tighter integration of flows, met... » read more

The Need For Speed: Wi-Fi 7 And The Era Of Ultra-Fast Internet


The exponential growth of data consumption and the proliferation of connected devices have driven the need for the development of Wi-Fi 7. With the increasing demand for high-speed internet access, especially in bandwidth-intensive applications such as streaming, gaming, and virtual reality, existing wireless standards have become inadequate to meet the evolving needs of users. Wi-Fi 7 addresse... » read more

Reaching For The Stars: Embracing Non-Terrestrial Networks In The Age Of 5G And Beyond


In the realm of modern connectivity, the race towards faster, more reliable networks has been relentless. With the advent of 5G technology, humanity is on the brink of a new era of communication, promising unprecedented speeds and capabilities. However, as we stand on the precipice of this digital revolution, it's imperative to look beyond the terrestrial confines that have defined our networks... » read more

AI/ML Challenges In Test and Metrology


The integration of artificial intelligence and machine learning (AI/ML) into semiconductor test and metrology is redefining the landscape for chip fabrication, which will be essential at advanced nodes and in increasingly dense advanced packages. Fabs today are inundated by vast amounts of data collected across multiple manufacturing processes, and AI/ML solutions are viewed as essential for... » read more

Strategies For Detecting Sources Of Silent Data Corruption


Engineering teams are wrestling with how to identify the root causes of silent data corruption (SDC) in a timely and cost-effective way, but the solutions are turning out to be broader and more complex than simply fixing a single defect. This is particularly vexing for data center reliability, accessibility and serviceability (RAS) engineering teams, because even the best tools and methodolo... » read more

MIMO Application Framework


Massive MIMO is an exciting area of 5G wireless research. For next-generation wireless data networks, it promises significant gains that offer the ability to accommodate more users at higher data rates with better reliability while consuming less power. Using the NI Massive MIMO Software Architecture, researchers can build Massive MIMO testbeds to rapidly prototype large-scale antenna systems u... » read more

Blog Review: Feb. 14


Siemens’ Dilan Heredia and Karen Chow explain why fast, accurate parasitic extraction (PEX) is essential to design success, especially for the 3 nm node and GAAFETs. Synopsys’ Srinivas Velivala debunks the myth that layout-versus-schematic (LVS) checking is a static step in the chip development process, and details its evolving role in modern SoCs. Cadence’s Mark Seymour digs into a... » read more

Adaptive Test Ramps For Data Intelligence Era


Widely available and nearly unlimited compute resources, coupled with the availability of sophisticated algorithms, are opening the door to adaptive testing. But the speed at which this testing approach is adopted will continue to vary due to persistent concerns about data sharing and the potential for IP theft and data leakage. Adaptive testing is all about making timely changes to a test p... » read more

Bridging The Connectivity Gap: Unraveling The Complexities Of Wireless Standard Deployments


By Alejandro Escobar Calderon and John Ye In the fast-paced world of technological evolution, the deployment of wireless standards has been touted as the gateway to a connected future. The promise of lightning-fast wireless connectivity has been a driving force behind the relentless pursuit of cutting-edge standards such as 4G, 5G, and new network architectures like Open RAN (O-RAN). However... » read more

Partnership To Improve Semiconductor Quality And Yield


By Eran Rousseau (NI) and Eli Roth (Teradyne) The semiconductor industry is notorious for its high production costs and the critical importance of maintaining impeccable product quality. As technology advances and consumer expectations rise, semiconductor companies face constant pressure to meet these cost and quality goals while also delivering cutting-edge products. Traditionally, the s... » read more

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