The Week In Review: Design


Tools & IP Cadence unveiled its latest DSP for embedded vision and AI, Tensilica Vision Q6 DSP. The DSP is built on a 13-stage processor pipeline and new system architecture designed for use with large local memories, and achieves 1.5GHz peak frequency and 1GHz typical frequency at 16nm. Compared to its predecessor, it offers 1.5X greater vision and AI performance than its predecessor and ... » read more

AI: The Next Big Thing


The next big thing isn't actually a thing. It's a set of finely tuned statistical models. But developing, optimizing and utilizing those models, which collectively fit under the umbrella of artificial intelligence, will require some of the most advanced semiconductors ever developed. The demand for artificial intelligence is almost ubiquitous. As with all "next big things," it is a horizonta... » read more

The Week In Review: Design


Security Addressing the Meltdown and Spectre speculative execution vulnerabilities has not gone smoothly. Intel's firmware update caused unexpected behavior and a higher than expected number of reboots for its Haswell and Broadwell chips, leading the company to recommend users stop patching until an updated version of the patch is available. Microsoft's attempts to fix the issue left some W... » read more

In Case You Missed It


We recently held two very successful seminars in Tokyo and Shanghai. Samsung Memory presented their HBM2 solutions, Samsung Foundry talked about their advanced 14nm FinFET solutions, ASE Group reviewed their advanced 2.5D packaging solutions, eSilicon presented our ASIC and 2.5D design/implementation and IP solutions, Rambus detailed their high-performance SerDes solutions and Northwest Logic p... » read more

What’s Next?


We just concluded two very successful seminars in Tokyo and Shanghai. Samsung Memory presented their HBM2 solutions, Samsung Foundry talked about their advanced 14nm FinFET solutions, ASE Group reviewed their advanced 2.5D packaging solutions, eSilicon presented our ASIC and 2.5D design/implementation and IP solutions, Rambus detailed their high-performance SerDes solutions and Northwest Logic ... » read more

Mixing Interface Protocols


Continuous and pervasive connectivity requires devices to support multiple interface protocols, but that is creating problems at multiple levels because each protocol is based on a different set of assumptions. This is becoming significantly harder as systems become more heterogeneous and as more functions are crammed into those devices. There are more protocols that need to be supported to ... » read more

The Week In Review: Design


Tools Imperas debuted its RISC-V Processor Developer Suite, a set of models, a software simulator, and tools to validate, verify, and provide early estimation of timing performance and power consumption for RISC-V processors. IP Minima Processor revealed its dynamic-margining subsystem IP for near-threshold voltage design. The startup's hardware and software IP works with a CPU or DSP proc... » read more

The Week In Review: Design


M&A Silvaco finalized its acquisition of SoC Solutions. The Georgia-based company was founded in 2000. Its team and portfolio of pre-configured IP subsystems and IoT/M2M IP will join Silvaco's IP group. Terms were not disclosed. Siemens PLM will acquire TASS International, a provider of simulation software, engineering and test services aimed primarily at the automotive industry. Based ... » read more

Start Your HBM/2.5D Design Today


High-bandwidth memory (HBM) is a JEDEC-defined standard, dynamic random access memory (DRAM) technology that uses through-silicon vias (TSVs) to interconnect stacked DRAM die. In its first implementation, it is being integrated with a system-on-chip (SoC) logic die using 2.5D silicon interposer technology. In June 2015, AMD introduced its Fiji processor, the first HBM 2.5D design, which comp... » read more

The Week In Review: Design


Tools Synopsys updated RSoft, its software for the design of photonic devices. The updates include increased integration with the company's TCAD products as well as faster simulations and additional ways to customize photonic device analysis. IP Mentor Graphics, Northwest Logic, and Krivi Semiconductor collaborated on DDR4 SDRAM IP to integrate design and verification into a single flo... » read more

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