Blog Review: Feb. 15


Mentor's Jean-Marie Brunet looks at factors driving the growth of hardware emulation for SoCs. Cadence's Dave Pursley asserts that the role of hardware developers is about to change for the better. Synopsys' Robert Vamosi says that major software vulnerabilities are becoming less frequent, in spite of hype surrounding named bugs. ARM's Rhonda Dirvin discusses the release of the OpenFog... » read more

Betting On Wafer-Level Fan-Outs


Advanced packaging is starting to gain traction as a commercially viable business model rather than just one more possible option, propelled by the technical difficulties in routing signals at 10nm and 7nm and skyrocketing costs of device scaling on a single die. The inclusion of a [getkc id="202" kc_name="fan-out"] package for logic in Apple's iPhone 7, based on TSMC's Integrated Fan-Out (... » read more

Blog Review: Jan. 18


Mentor's Michael White warns that while skipping a node can be appealing, be prepared for the increase in computation requirements. Synopsys' Hezi Saar checks out the benefits of moving to the MIPI I3C standardized sensor interface. Cadence's Paul McLellan highlights a talk by Eric Grosse on approaches to security and the RISC-V architecture. Applied's Mike Chudzik explains the problem... » read more

Mobile Processors Move Beyond Phones


Mobile processors, also known as application processors, are well-known as the engines that run smartphones, tablet computers, and other wireless devices. But these chips increasingly are finding their way into autonomous vehicles, the Internet of Things, unmanned aerial vehicles, virtual reality, and other applications far beyond phone calls and text messages. Moreover, they are gaining in com... » read more

In-Vehicle Networks Are Safety, Security Dependent


It’s clear that managing, defining and prioritizing data traffic within vehicles is becoming an enormous challenge particularly with the growing number of networks , and underpining it all are safety and security concerns. Rob Knoth, product management director for the DSG group at Cadence observed, “The more you try to integrate traffic onto one bus, the more you are exposing systems th... » read more

The Week In Review: Design


IP eSilicon launched 14nm FinFET and 28nm planar HBM Gen2 Hardened PHY. It supports up to 256Gbytes/sec bandwidth with 8x128b channels at 2Gbps per I/O, and the integrated I/O supports up to 2Gbps DDR operation across a 4mm interposer channel. The PHY was developed on Samsung 14LPP and TSMC 28HPC technologies. Flex Logix designed a high-performance embedded FPGA IP core for TSMC 16FF+ and... » read more

Blog Review: Dec. 14


What are the technology options for 5nm? Cadence's Paul McLellan highlights an IEDM presentation by An Steegen of Imec. Synopsys' Michael Posner suggests we may not have to live with USB Type-C dongles for very long. Mentor's Craig Armenti presents some of the fundamental best practices and guidelines for rigid-flex PCB design. NXP's Joe Byrne digs into the Mirai botnet attack, arguing... » read more

Blog Review: Dec. 7


Mentor's Harry Foster looks at verification results findings in terms of schedules, number of required spins, and classification of functional bugs, in the latest installment of the Wilson Research Group verification study. Cadence's Paul McLellan provides an overview of the portable stimulus standard currently being worked on at Accellera. Synopsys' Anika Malhotra checks out JESD204B, a ... » read more

The Week In Review: Design


Deals Kilopass extended its deal with ICScape, which makes a Parallel SPICE simulator, for eNVM IP at advanced finFET nodes. Kilopass has been working with ICScape for the past couple of years as part of its qualification methodology. IP Silvaco released three MIPI I3C sensor controller IP cores. Developed with NXP to push adoption of I3C, the new products are an Advanced Slave core wi... » read more

Harder Than It Looks


First Apple scales back plans to develop its own vehicle. Then Intel creates its own automotive chip unit. This kind of two-step movement in the automotive electronics industry is becoming more common. NXP buys Freescale, then Qualcomm buys NXP. Harman buys Symphony Teleca and Red Bend Software, then Samsung buys Harman. All of these moves are proof points that innovation and fleet-foo... » read more

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