tag: Oxford

Week In Review: Manufacturing, Test
By Mark LaPedus - 08 Oct, 2021 - Comments: 0

Government policy Hoping to resolve the ongoing worldwide chip shortage situation, the U.S. Department of Commerce late last month launched a “request for information (RFI)” initiative, which involved sending questionnaires to various semiconductor companies. The U.S. government is asking all parts of the supply chain – producers, consumers, and intermediaries – to voluntarily share in... » read more

Angstrom-Level Measurements With AFMs
By Mark LaPedus - 19 Aug, 2021 - Comments: 0

Competition is heating up in the atomic force microscopy (AFM) market, where several vendors are shipping new AFM systems that address various metrology challenges in packaging, semiconductors and other fields. AFM, a small but growing field that has been under the radar, involves a standalone system that provides surface measurements on structures down to the angstrom level. (1 angstrom = 0... » read more

Atomic Layer Etch Expands To New Markets
By Mark LaPedus - 16 Jul, 2020 - Comments: 0

The semiconductor industry is developing the next wave of applications for atomic layer etch (ALE), hoping to get a foothold in some new and emerging markets. ALE, a next-generation etch technology that removes materials at the atomic scale, is one of several tools used to process advanced devices in a fab. ALE moved into production for select applications around 2016, although the technolog... » read more

System Bits: July 15
By Jeff Dorsch - 15 Jul, 2019 - Comments: 0

Automating bridge inspections with robotics The University of Waterloo has come up with robotics that could be used in automated inspection of bridges, making sure such critical infrastructure is safe and sound. The technology promises to make bridge inspection cheaper and easier. The system collects data for defect detection and analysis through a combination of autonomous robots, cameras,... » read more

Power/Performance Bits: Oct. 25
By Jesse Allen - 25 Oct, 2016 - Comments: 0

Energy-harvesting floor Engineers at the University of Wisconsin-Madison developed a flooring material which can be used as a triboelectric nanogenerator to convert footsteps into electricity. The method uses wood pulp, a common waste material already often used in flooring. The pulp is partly make of cellulose nanofibers, which when chemically treated produce an electrical charge when th... » read more

Manufacturing Bits: June 17
By Mark LaPedus - 17 Jun, 2014 - Comments: 1

PiezoFET debuts The University of Twente MESA+ Research Institute and SolMateS have put a new twist on the finFET. A piezoelectric stressor layer has been deposited around the finFET, thereby enabling what researchers call the PiezoFET. The PiezoFET could enable steep sub-threshold slope devices. In the lab, this device was also able to reduce the leakage by a factor of five. [caption id... » read more

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