Stacked Die Changes


Semiconductor Engineering sat down to discuss advanced packaging with David Pan, associate professor in the department of electrical and computer engineering at the University of Texas; Max Min, senior technical manager at [getentity id="22865" e_name="Samsung"]; John Hunt, senior director of engineering at ASE; and Sitaram Arkalgud, vice president of 3D portfolio and technologies at Invensas. ... » read more

Noise Killed My Chip


In the past, noise was considered an annoyance, especially for analog circuitry. But today chips are actually failing because insufficient analysis was performed. Noise types that used to be second-order effects are becoming primary factors that have to be considered. This is happening at the same time that noise margins are getting smaller, both in the amplitude and temporal dimensions. It ... » read more

Surprises At Hot Chips 2016


Who would have thought an Intel architect would be on stage talking about cutting pennies out of MCU prices? Or that Nvidia would be trumpeting an automotive SoC whose chief performance advantages come from the integration of ARM CPUs that can support up to eight virtual machines? Or that Samsung would be developing a quad-core mobile processor from scratch based on its own unique architecture?... » read more

Stacking Logic On Logic


Advanced packaging can be an alphabet soup of possible approaches, from heterogenous integration of multiple die types into a single package, to three-dimensional stacking of multiple dies on top of each other. Three-dimensional chip stacking is most commonly seen in memory devices. Applied to logic, though, there are at least two different ways for integration to proceed. Completely process... » read more

Plotting The Next Semiconductor Road Map


The semiconductor industry is retrenching around new technologies and markets as Moore's Law becomes harder to sustain and growth rates in smart phones continue to flatten. In the past, it was a sure bet that pushing to the next process node would provide improvements in power, performance and cost. But after 22nm, the economics change due to the need for multi-patterning and finFETs, and th... » read more

Foundries Expand Their Scope


By Ed Sperling & Mark LaPedus Major foundries are stepping up their offerings across a wide swath of technology nodes, specialty processes and advanced packaging—a recognition that end markets are fragmenting and that the path forward includes a mix of new and established processes. As the smart phone market flattens, there is no single "next big thing" to drive volume at the most ... » read more

The Future Of MEMS Sensor Design And Manufacturing


I recently gave an invited talk at the IEEE Inertial Sensors 2016 symposium that discussed the future of commodity MEMS inertial sensor design and manufacturing. Inertial sensors comprise one of the fastest growing and most successful segments of the MEMS market. There are three industry trends that I believe will have major implications for motion sensor design and manufacturing and, more g... » read more

Samsung Foundry’s Business Strategy


Wow! 2016 is off to a fast start. While visiting headquarters in Korea recently, I sat down with four members of Samsung Foundry’s global leadership team to discuss several key initiatives this year. Below are key excerpts from those conversations. Samsung Foundry’s Business Strategy Q: Can you expand on some of the macro business trends affecting the fabless/foundry industry? Jong S... » read more

Have Margins Outlived Their Usefulness?


To automate the process of solving complex design problems, the traditional approach has been to partition them into smaller, manageable tasks. For each task, we have built the best possible solution which we continuously refine over time. Additionally, we have managed the interdependencies between tasks by defining boundaries or margins; these often have been best- and worst-case values used t... » read more

China: Strong Market Growth And Innovation In Packaging


By Shanshan Du Since the mid-1980s, packaging and assembly have been key segments of the semiconductor supply chain in China. In the past decade, the fast growing market of electronic product manufacturing in China occurred concurrently with the innovation and growth in China for packaging and assembly. SEMI China researched the packaging and assembly industry segment and observed a total... » read more

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