Reflection On 2017: Design And EDA


People love to make predictions, and most of the time they have it easy, but at Semiconductor Engineering, we ask them to look back on the predictions they make each year and to assess how close to the mark they were. We see what they missed and what surprised them. Not everyone accepts our offer to grade themselves, but most have this year. (Part one looked at the predictions associated with s... » read more

The Week In Review: Design


Altium released the latest version of its PCB design suite. Improvements include a new interface and an upgrade to 64-bit architecture combined with multi-threaded task optimizations. Other additions include a new BoM rule checker and length tuning and pin-swapping in the user-guided routing engine. Creonic announced a new line of IP for 5G forward error correction. The product line covers t... » read more

The Week In Review: Design


M&A Design services firm Synapse Design acquired the assets of ACEIC Design Technologies, including the engineering team and verification IP. ACEIC, which was based in Bangalore, primarily focused on verification services for wireless 802.11ac MAC IP. This is only the latest expansion move from Synapse. Earlier this year, the company acquired the services companies Tech Vulcan in San Diego... » read more

Collaborative Multi-Board System Design


Designing electronic systems has become measurably more complex during the past decade. Many of the products that are developed today are in-fact complex interconnected systems. Using the automotive market as an example, the first level of a system is an element; an individual component or sub-assembly that is designed to be part of a larger collaborating function. At the next level is the sub-... » read more

Save Time And Minimize Errors By Automating Co-Design And Co-Analysis Of Chips, PCBs, And Packages


Given the complexity of today’s chips, packages, and PCBs, designing each in isolation is no longer judicious. Cross-domain co-design and co-analysis are key to ensuring optimal performance, cost reduction, and faster time to market. Such capabilities are provided by the Cadence Virtuoso System Design Platform, which integrates IC design—including multiple heterogeneous die—into the Alleg... » read more

Why Is TCAM Essential For The Cloud?


With port speeds exceeding 100Gbps, route lookups that are fundamental to all routers have relied on ternary content addressable memories (TCAMs) to provide a lookup response within a clock cycle. However, TCAMs in discrete form are expensive, consume a lot of power, compete for precious real estate on the printed circuit board (PCB), and often lack required flexibility. Embedding a TCAM block ... » read more

Looking Back at Board Test


Printed circuit board testing has been around as long as printed circuit boards, also known as printed circuit assemblies and printed wiring boards. PCB technology started in the early 20th century with Thomas Edison and other inventors. As boards shrink to fit inside wearable gadgets and other products with compact form factors, PCB test equipment vendors are addressing new challenges. Boar... » read more

7 Design Aspects of IoT PCB Designs


To consumers, IoT devices look sleek and simple, but they are comprised of a distinct set of components, physical interfaces, PCBs, and circuitry that presents unique design and layout challenges. This paper looks at seven things to consider when designing PCBs for successful IoT devices. To read more, click here. » read more

Electrothermal Mechanical Stress Reference Design Flow For Printed Circuit Boards And Electronic Packages


This paper presents a reference design flow for solving the electrical, thermal and mechanical challenges of a printed circuit board (PCB) using simulation tools from ANSYS. This approach can be utilized for all electrical CAD (ECAD) types such as IC packages, touch panel displays, and glass and silicon interposers. The authors followed this reference design flow for analyzing a PCB virtual pro... » read more

Chip-Package-Board Issues Grow


As systems migrate from a single die in a single package on a board, to multiple dies with multiple packaging options and multiple PCB form factors, it is becoming critical to move system planning, assembly, and optimization much earlier in the design-through-manufacturing flow. This is easier said than done. Multiple tools and operating systems are now used at each phase of the flow, partic... » read more

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