tag: PCB

PCB And IC Technologies Meet In The Middle
By Bryon Moyer - 12 Oct, 2021 - Comments: 1

Surface-mount technology (SMT) is evolving far beyond its roots as a way of assembling packaged chips onto printed circuit boards without through-holes. It is now moving inside packages that will themselves be mounted on PCBs. But SMT for advanced packages isn’t the same as the SMT we’ve been used to. “Many systems include multiple ASICs, a lot of memory, and that's all integrated i... » read more

Fast And Simple Rigid-Flex PCB Bending EM Analysis Using Clarity 3D Solver
By Cadence - 06 Oct, 2021 - Comments: 0

3D PCB Electromagnetic (EM) Bending Analysis Rigid-Flex PCBs have been used in many modern electronic devices (such as mobile phones, laptops, and wearables, among others), due to their form factor, light weight, and cost-effectiveness. Electromagnetic (EM) analysis of Rigid-Flex PCBs has always been a challenging task for many commercially available 3D numerical solver technologies (FEM and F... » read more

PCB Design Rules For Electromagnetic Compatibility
By Nikhil Grover - 08 Apr, 2021 - Comments: 0

When it comes to electromagnetic interference (EMI) and printed circuit boards (PCBs), rules are not meant to be broken. Following some simple guidelines for electromagnetic compatibility when designing PCBs will save time and costs. Simulation software can help. All high-speed signals on a PCB should be referenced to a solid plane. A current flowing in any trace on a PCB must complete the e... » read more

Modeling PCBs For Common Causes Of Failure
By Theresa Duncan - 11 Feb, 2021 - Comments: 0

By Theresa Duncan and Michael Blattau When designing printed circuit boards (PCBs), keep in mind the major causes of electronic failure: thermal cycling, vibration, and mechanical shock and drop. You can perform a variety of physical tests to determine how and why electronics fail, however, a much faster and cost-effective solution is PCB modeling and simulation. When simulation is used i... » read more

Uniquely Identifying PCBs, Subassemblies, And Packaging
By Bryon Moyer - 18 Nov, 2020 - Comments: 0

Securing the semiconductor supply chain is becoming much more difficult as devices increasingly are disaggregated, a shift being forced on the industry due to the rising cost of scaling and the need for more customization and faster time to market. Individual component IDs are an important starting point for supply chain trust, but they are no longer sufficient. Those components will end up ... » read more

Rigid-Flex PCB Bending EM Analysis Using Clarity 3D Solver
By Cadence - 28 Oct, 2020 - Comments: 0

Rigid-Flex PCBs have been used in many modern electronic devices (such as mobile phones, laptops, and wearables, among others), due to their form factor, light weight, and cost-effectiveness. Electromagnetic (EM) analysis of Rigid-Flex PCBs has always been a challenging task for many commercially available 3D numerical solver technologies (FEM and FDTD), due to the complexity in the 3D designs.... » read more

Demand Grows For Reducing PCB Defects
By Anne Meixner - 13 Oct, 2020 - Comments: 0

Board manufacturers are boosting their investment in inspection, test and analytics to meet the increasingly stringent demands for reliability in safety-critical sectors like automotive. This represents a significant shift from the past, where concerns about reliability primarily targeted the devices connected to printed circuit boards. But as SoCs become disaggregated into advanced packages... » read more

System-Level Packaging Tradeoffs
By Ann Mutschler - 30 Sep, 2020 - Comments: 0

Leading-edge applications such as artificial intelligence, machine learning, automotive, and 5G, all require high bandwidth, higher performance, lower power and lower latency. They also need to do this for the same or less money. The solution may be disaggregating the SoC onto multiple die in a package, bringing memory closer to processing elements and delivering faster turnaround time. But ... » read more

Best Practices And Constraint Management Tools Speed RF Design For The IoT
By Jim Martens - 06 Aug, 2020 - Comments: 0

By Jim Martens and David Zima The IoT has increased the demand for good radio frequency (RF) design practices from the mains, to wall outlet power, all the way to the antenna. With several IoT standards employed today, constraint management has become critical to ensuring that designs meet product performance and reliability. Even the simplest of IoT designs can benefit from constraint ma... » read more

Easier Bond Finger Solder Mask Openings
By Tyler Lockman - 09 Apr, 2020 - Comments: 0

If you design wire bond packages, you’re familiar with the need for the bond fingers and rings on the package substrate layers to be exposed through the solder mask layer. If they aren’t, it becomes… rather difficult… to bond the wire to them, after all! We talked about general-purpose bounding shapes a few weeks ago in “A Boundless Bounty of Bounding Shapes”. Bond fingers have a... » read more

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