Multi-Patterning Issues At 7nm, 5nm


Continuing to rely on 193nm immersion lithography with multiple patterning is becoming much more difficult at 7nm and 5nm. With the help of various resolution enhancement techniques, optical lithography using a deep ultraviolet excimer laser has been the workhorse patterning technology in the fab since the early 1980s. It is so closely tied with the continuation of [getkc id="74" comment="Mo... » read more

More EUV Mask Gaps


Extreme ultraviolet (EUV) lithography is at a critical juncture. After several delays and glitches, [gettech id="31045" comment="EUV"] is now targeted for 7nm and/or 5nm. But there are still a number of technologies that must come together before EUV is inserted into mass production. And if the pieces don’t fall into place, EUV could slip again. First, the EUV source must generate more ... » read more

Mastering The Magic Of Multi-Patterning


Multi-patterning technology was introduced at the 20 nm node to overcome lithographic limitations in current IC manufacturing processes. While processes like double and triple patterning may sometimes seem like magic, successfully implementing multi-patterning compliance in the IC design and verification flow requires a thorough understanding of multi-patterning techniques and their impact on y... » read more

Why EUV Is So Difficult


For years, extreme ultraviolet (EUV) lithography has been a promising technology that was supposed to help enable advanced chip scaling. But after years of R&D, EUV is still not in production despite major backing from the industry, vast resources and billions of dollars in funding. More recently, though, [gettech id="31045" comment="EUV"] lithography appears to be inching closer to pos... » read more

Mask Maker Worries Grow


Photomasks are becoming more complex and expensive at each node, thereby creating a number of challenges on several fronts. For one thing, the features on the [getkc id="265" kc_name="photomask"] are becoming smaller and more complex at each node. Second, the number of masks per mask-set are increasing as a result of multiple patterning. Third, it costs more to build and equip a new mask fab... » read more

Mask Maker Worries Grow


Leading-edge photomask makers face a multitude of challenges as they migrate from the 14nm node and beyond. Mask making is becoming more challenging and expensive at each node on at least two fronts. On one front, mask makers must continue to invest in the development of traditional optical masks at advanced nodes. On another front, several photomask vendors are preparing for the possible ra... » read more

Next EUV Challenge: Pellicles


Extreme ultraviolet (EUV) lithography is still not ready for high-volume manufacturing, but the technology is at least moving in the right direction. Both the [gettech id="31045" comment="EUV"] light source and resists are making noticeable progress, even though there are still challenges in the arena. And then, there is the EUV mask infrastructure, which also has some gaps. “When EUV i... » read more

Where Is Next-Gen Lithography?


Semiconductor Engineering sat down to discuss lithography and photomask technologies with Greg McIntyre, director of the Advanced Patterning Department at [getentity id="22217" comment="Imec"]; Harry Levinson, senior fellow and senior director of technology research at [getentity id="22819" comment="GlobalFoundries"]; Uday Mitra, vice president and head of strategy and marketing for the Etch Bu... » read more

GPU-Based Computing In Photomask Manufacturing


Graphical-processing unit (GPU)-accelerated computing has reached maturity for professional, scientific computing applications. One example of this is the recent GPU-accelerated thermal application for semiconductor photomask manufacturing, which is used in 24/7 manufacturing environments. GPU-accelerated computing won’t be a universal panacea for the semiconductor industry’s “need for sp... » read more

Tech Talk: GPU-Accelerated Photomasks


Noriaki Nakayamada, group manager for the data control engineering group in NuFlare's Mask Lithography engineering Department, talks about what's changing on the mask side, where the trouble spots are, and how to deal with them at advanced process nodes. [youtube vid=f8PixJMadXw] » read more

← Older posts