Unsolved Litho Issues At 7nm


By Ed Sperling & Mark LaPedus EUV lithography is creating a new set of challenges on the photomask side for which there currently are no simple solutions. While lithography is viewed as a single technology, [gettech id="31045" comment="EUV"] actually is a collection of technologies. Not all of those technologies have advanced equally and simultaneously, however. For example, aberrations... » read more

Challenges Mount For Photomasks


Semiconductor Engineering sat down to discuss photomask technologies with Naoya Hayashi, research fellow at Dai Nippon Printing (DNP); Banqiu Wu, principal member of the technical staff and chief technology officer of the Mask and TSV Etch Division at [getentity id="22817" e_name="Applied Materials"]; Weston Sousa, general manager of the Reticle Products Division at [getentity id="22876" commen... » read more

Getting Ready For EUV


The highly anticipated introduction of extreme ultra-violet (EUV) lithography is reflected in recent surveys conducted by the eBeam Initiative, which will be presented on Sept. 11 at the annual Photomask Technology Symposium in Monterey, Calif.  There are many changes are coming to the mask industry, in addition to EUV. Those include greater use of inverse-lithography technologies (ILT) and... » read more

What’s Changing At BACUS


Jim Wiley, president of SPIE BACUS, talks about this year's merger of the EUV Lithography Symposium and the SPIE Photomask Conference—including what's new and different, the latest updates on the event location, and topics to look forward to such as EUV mask inspection—as well as his predictions on machine learning. https://youtu.be/GNxUmMAU9zs » read more

Mask Modeling In The EUV Era


D2S reviews the challenges of mask modeling in the EUV era, including the need for dose/shape separation and mid-range correction, and the impact of GPU acceleration. https://youtu.be/iVqkoVMbK4o » read more

The Future Of Patterning


Greg McIntyre, director of advanced patterning at imec, offers his thoughts on what it’s like to work at one of the world’s leading nanoelectronics R&D centers, as well as the importance of eBeam technology to lithography and mask making, what’s driving up confidence in EUV, and the latest on imec’s joint venture with JSR in EUV resist development. [youtube vid=q8cA_9rWecU] » read more

Inside Lithography And Masks


Semiconductor Engineering sat down to discuss lithography and photomask technologies with Gregory McIntyre, director of the Advanced Patterning Department at [getentity id="22217" e_name="Imec"]; Harry Levinson, senior fellow and senior director of technology research at [getentity id="22819" comment="GlobalFoundries"]; David Fried, chief technology officer at [getentity id="22210" e_name="Cove... » read more

Big Changes In Patterning


Aki Fujimura, CEO of [getentity id="22864" comment="D2S"], sat down with Semiconductor Engineering to discuss patterning issues at 10nm and below, including mask alignment, the need for GPU acceleration, EUV's future impact on the total number of masks, and what the re-introduction of curvilinear shapes will mean for design. SE: Patterning issues are getting a lot of attention at 10nm and 7n... » read more

Battling Fab Cycle Times


The shift from planar devices to finFETs enables chipmakers to scale their processes and devices from 16nm/14nm and beyond, but the industry faces several challenges at each node. Cost and technical issues are the obvious challenges. In addition, cycle time—a key but less publicized part of the chip-scaling equation—also is increasing at every turn, creating more angst for chipmakers and... » read more

Inside Photomask Writing


Hirokazu Yamada, a board member and the director of the Mask Lithography Division of NuFlare, sat down with Semiconductor Engineering to discuss photomask technology, e-beam mask writer trends and other topics. NuFlare is the world’s largest supplier of e-beam mask writers. What follows are excerpts of that conversation. SE: How does the [getkc id="265" kc_name="photomask"] market look in... » read more

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