Interconnect Challenges Rising


Chipmakers are ramping up their 14nm finFET processes, with 10nm and 7nm slated to ship possibly later this year or next. At 10nm and beyond, IC vendors are determined to scale the two main parts of the [getkc id="185" kc_name="finFET"] structure—the transistor and interconnects. Generally, transistor scaling will remain challenging at advanced nodes. And on top of that, the interconnects ... » read more

Advanced Lithography: Moore’s Law Moves On


Every February, experts in nano patterning technologies converge in San Jose, Calif., to present their road maps, brainstorms and results at the SPIE Advanced Lithography Symposium. This year, there was more confusion than ever, partly the result of sessions in unlabeled (but beautiful) new ballrooms at the Convention Center, but mostly because of industry divergences. There is no longer a s... » read more