The Great Imbalance


The number of options for chipmakers is growing while the number of chipmakers is shrinking. So what does this mean for the semiconductor industry? Short answer: No one is quite sure yet. But a lot more people are beginning to ask that question these days, including investors and analysts. There are a number of factors at play here. To begin with, there are more nodes to choose from than at ... » read more

Time To Look At SOI Again


Chipmakers have the luxury of looking at several process options when developing chips at the 28nm node and beyond. Using bulk CMOS, for example, chipmakers can scale planar transistors down to 20nm. Then, at 20nm, planar runs out of gas due to the so-called short-channel effect. At that point, IC makers must migrate towards finFETs at 16nm/14nm and beyond. Another process option is fully... » read more

Leti Outlines FDSOI And Monolithic 3D IC Roadmaps


Semiconductor Engineering discussed the future roadmaps for fully depleted silicon-on-insulator (FDSOI) technology and monolithic 3D chips with Maud Vinet, manager for the Innovative Devices Laboratory at CEA-Leti. SE: What are some of the technologies being developed at the Innovative Devices Laboratory? Vinet: The Innovative Devices Laboratory is involved with advanced CMOS. So basically... » read more

FD-SOI bests FinFETs for mobile multimedia SOCs? ST says yes.


In a recent and excellent article in ASN by Thomas Skotnicki, Director of the Advanced Devices Program at STMicro, he explains in a very clear and accessible way why FD-SOI with ultra-thin Body & Box (UTBB) is a better solution for mobile, multimedia SOCs than FinFETs -- starting at the 28nm node and running clearly through 8nm.  It is based on the paper he presented at the 2011 IEEE SOI C... » read more