Extending The IC Roadmap


An Steegen, executive vice president of semiconductor technology and systems at Imec, sat down with Semiconductor Engineering to discuss IC scaling and chip packaging. Imec is working on next-generation transistors, but it is also developing several new technologies for IC packaging, such as a proprietary silicon bridge, a cooling technology and packaging modules. What follows are excerpts of t... » read more

How Switching Activity Impacts A Design’s Power And Reliability


Electronics continue to gain presence in both familiar and unfamiliar areas of our lives. Electronics is a common thread among the cars we drive, the computers we use, the mobile phones and wearable devices that we rely on. We appreciate the information and convenience that Fitbits and other products such as coffee makers, credit cards and building security cards provide us. And we are beginni... » read more