Hitting The Power Integrity Wall At 10nm

At 10nm and beyond, the breakdown of some historic trends tied to Moore's Law is making it harder to fully harvest the benefits of scaling semiconductor technologies. Underlying the power, performance and area benefits of scaling are technological challenges that must be solved in order to make the semiconductor products a profitable business. Power-related challenges are among the most pres... » read more

Power Integrity Optimization Cuts RF Substrate Noise

Our main focus is on dynamic voltage drop at 16-14-10nm and beyond, but the rise of the Internet of Things (IoT) prompted me to share some silicon measurement results that are relevant to the RF design community. Normally, power integrity (PI) is looked at in the time domain, but in this work we looked at it from a frequency spectrum perspective. Silicon measurements prove how shaping the dynam... » read more

Power Breaks Everything

The emphasis on lowering power in everything from wearable electronics to data centers is turning into a perfect storm for the semiconductor ecosystem. Existing methodologies need to be fixed, techniques need to be improved, and expectations need to be adjusted. And even then the problems won't go away. In the past, most issues involving power—notably current leakage, physical effects such... » read more

IP Design Essentials For Reliability And SoC Integration

IP is integral to every SoC design. The need for ubiquitous connectivity has pushed the threshold for content in SoCs even beyond the tenets of Moore’s Law. Technology scaling has not only enabled the delivery of increased performance and reduced power, but also rich content through the integration of a wide range of IPs such as radio devices, CMOS image sensors, MEMs, etc., into a single ... » read more

Signal And Power Integrity Cross Paths

Signal integrity and power integrity historically have been relatively independent issues, and engineers with expertise in one area generally operate independently of the other. But as more power domains are added to conserve energy and allow more features, as voltages are reduced to save battery life, and as dynamic power becomes more of a concern at advanced nodes, these worlds are suddenly m... » read more

IP Design Essentials For Power Integrity

Smart connectivity is the new mantra of today – the ability to connect to anything, anywhere and at any time. With such technology enablement, low power is not a choice but an expectation. Whether it is a connected device, or a system that is part of the infrastructure, they are driven to integrate various functionality such as high speed computing, high-speed memory, memory interfaces, radio... » read more

Power And Noise Integrity For Analog / Mixed-Signal Designs

The convergence of advance process technology, increasing levels of integration, and higher operating frequencies pose considerable challenge to IP designers whose circuits are required to function in variety of conditions. Full-custom and mixed signal circuit designers ensure that their circuits will function by simulating for various operating conditions (PVT, input stimuli, etc). One key asp... » read more

The Week In Review: Design

Tools Cadence rolled out a custom power integrity tool for dealing with transistor-level electromigration and IR drop with SPICE-level accuracy. It works in conjunction with the company’s existing power integrity tool for cell-level power signoff. Open-Silicon established a high-speed SerDes technology center of excellence to speed design and production of ASICs using high-speed serial co... » read more

SoC Power Integrity And Sign-Off For 28nm Designs

A presentation discussing how RedHawk enables physical design weakness identification, automatic repair the source of the supply noise, analyze impact of dynamic voltage drop on timing and jitter, verify power and signal EM, and provide a model of the chip’s PDN for system-level analysis. To view this video tutorial, click here. » read more

Challenges In IC And Electronic Systems Verification

Power efficiency, unrealistic schedules, and cost-down considerations are increasingly the top challenges design teams must meet to deliver next generation electronic systems, whether it is for the mobile, server, or automotive market. In addition, a successful chip tapeout does not guarantee the eventual end-product’s success—there are many variables to take into account. In the first p... » read more

← Older posts