Tech Talk: Power Signoff


Ansys' Aveek Sarkar the challenges of power signoff at advanced process nodes, the impact of over-design, and what's necessary for sufficient coverage. [youtube vid=VQoT2KYW-AM] » read more

The Week in Review: System-Level Design


Cadence unveiled its next-gen power signoff tool, this one based upon parallel execution across multiple processors. The result is 10x speed improvement, according to the company. The signoff solution already is certified for TSMC’s 16nm finFET process for IR drop analysis and EM rule compliance, two of the big concerns with finFETs. Synopsys teamed up with CEVA to improve PPA for CEVA’s... » read more