Challenges Grow For IP Reuse


As chip complexity increases, so does the complexity of IP blocks being developed for those designs. That is making it much more difficult to re-use IP from one design to the next, or even to integrate new IP into an SoC. What is changing is the perception that standard [getkc id="43" kc_name="IP"] works the same in every design. Moreover, well-developed [getkc id="100" kc_name="methodologie... » read more

Users Talk Back On Standards Process


One of the major themes of DVCon this year was the standard that currently goes by the name of Portable Stimulus (see related story, Portable Stimulus – The Name Must Change). It is not ready for prime time yet, but there was plenty to hear and learn about the emerging standard, including what users think about it and the standardization process. The panel gave the users the opportunity to vo... » read more

Big Data On Wheels


By Jeff Dorsch & Ed Sperling All kinds of chips are going into driver-assisted and autonomous cars. On one side are arrays of sensors, which are generating huge amounts of data about everything from lane position and proximity to other cars to unexpected objects in the road. On the other side are the chips required to process that data at blazing speed. As the market for PCs and mobil... » read more

The Week In Review: Design


Tools Mentor Graphics launched the company's third generation data-center friendly emulation platform, Veloce Strato. The emulator has a capacity of 2.5BG when fully loaded, and total capacity can be increased by linking emulators. It has available slots for 64 Advanced Verification Boards (AVBs) and fully loaded consumes up to 50KW (22.7 W/Mgate) of power. Aldec uncorked the latest versi... » read more

The Week In Review: IoT


Market Research There will be 8.4 billion connected things in use this year, a 31% gain from 2016, and leading up to 20.4 billion connected devices in 2020, according to Gartner. The market research firm estimates worldwide spending on endpoints and services will hit nearly $2 trillion in 2017. Greater China, North America, and Western Europe account for two-thirds of the IoT installed base th... » read more

Betting On Wafer-Level Fan-Outs


Advanced packaging is starting to gain traction as a commercially viable business model rather than just one more possible option, propelled by the technical difficulties in routing signals at 10nm and 7nm and skyrocketing costs of device scaling on a single die. The inclusion of a [getkc id="202" kc_name="fan-out"] package for logic in Apple's iPhone 7, based on TSMC's Integrated Fan-Out (... » read more

Chaos, Progress In Mobile Payment Security


Semiconductor suppliers and their embedded software partners, internally and externally, have made tremendous strides in recent years supporting secure mobile payment processing. It hasn't been easy. Or simple. And it's still evolving. The result of those efforts, which is now set to play an increasingly important and widespread commercial role in 2017, are trusted execution environment t... » read more

The Week In Review: Manufacturing


Chipmakers 2017 is just getting underway and there appears to be more restructuring in the IC industry. Toshiba is looking to spin off its semiconductor division and Western Digital (WD) plans to take a minority stake, according to Nikkei, which added that Toshiba would sell a 20% stake for 200-300 billion yen ($1.78-$2.65 billion). “The arrangement would provide Toshiba with short term fund... » read more

The Week In Review: IoT


Products Intel on Monday unveiled the Responsive Retail Platform, with CEO Brian Krzanich making a presentation at the National Retail Federation’s Big Show conference. “Intel’s Internet of Things (IoT) and cloud technologies touch every link of the retail supply chain. IoT sensors capture data that can be analyzed. Data centers crunch the information and give it real-world usefulness,... » read more

China Unveils Memory Plans


Backed by billions of dollars in government funding, China in 2014 launched a major initiative to advance its domestic semiconductor, IC-packaging and other electronic sectors. So far, though, the results are mixed. China is making progress in IC-packaging, but the nation’s efforts to advance its domestic logic and memory sectors are still a work in progress. In fact, China has yet to achi... » read more

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