The Data Center In 2018 And Beyond


As computing continues to evolve, a number of trends are continuing to challenge the design of conventional von Neumann architectures, and in turn are driving the development of new architectural approaches and technologies. These include the growing adoption of artificial intelligence (AI), machine learning, AR/VR, IoT, high-speed financial transactions, self-driving vehicles, and blockchain/c... » read more

Turning Down The Power


Chip and system designers are giving greater weight to power issues these days. But will they inevitably hit a wall in accounting for ultra-low-power considerations? Performance, power, and area are the traditional attributes in chip design. Area was originally the main priority, with feature sizes constantly shrinking according to Moore's Law. Performance was in the saddle for many years. M... » read more

What Will 2018 Bring To The IoT?


The Internet of Things is widely expected to progress in 2018—especially the Industrial IoT—as industry standards get hashed out and more vendors take cybersecurity seriously. On the home front, many Americans are growing accustomed to artificial intelligence technology from their use of Amazon Echo, Apple HomeKit, and Google Home devices. They’re talking to their remote controls to ch... » read more

Blog Review: Jan. 10


Rambus' Aharon Etengoff explains the Meltdown and Spectre CPU vulnerabilities and why they could negatively affect the semiconductor industry for decades. Cadence's Paul McLellan has an explainer on Meltdown and how it's an unintended consequence of a processor behaving as intended. Mentor's Ruben Ghulghazaryan and Jeff Wilson investigate using machine learning to predict post-deposition ... » read more

Reshaping Automotive Design


The entire automotive ecosystem is being reshaped by vehicle electrification, assisted and autonomous driving, and the connectivity needed to make it all work. So far, it's not clear just how smoothly this will all come together. In this redefined world, electronics and software will provide differentiation rather than mechanical engineering and possibly even brand name, creating change on a... » read more

Protecting Electronic Systems From Side-Channel Attacks


During the early days of safecracking, rudimentary rotary locks were compromised by feel or sound to determine the correct combination. Following in this tradition, malicious actors are now exploiting side-channel attacks (SCA) to compromise cryptographic systems. To be sure, all physical electronic systems routinely leak information about the internal process of computing via fluctuating level... » read more

Thwarting Side-Channel Attacks With DPA-Protected Software Libraries


All physical electronic systems routinely leak information about the internal process of computing via fluctuating levels of power consumption and electro-magnetic emissions. Much like the early days of safecracking, electronic side-channel attacks (SCA) eschew a brute force approach to extracting keys and other secret information from a device or system. Moreover, SCA conducted against elec... » read more

Blockchain: Hype, Reality, Opportunities


Blockchain buzz has reached deafening levels, and its proponents say we haven’t heard anything yet. The blockchain-enabled transformations they describe make the Internet revolution look almost trivial. Critics argue that too many people drank the blockchain Kool-Aid. Outside the cryptocurrency arena, they say that blockchain amounts to little more than some really slick slideware. The ... » read more

Mixed-Signal Issues Worse At 10/7nm


Despite increasingly difficulty in scaling digital logic to 10/7nm, not all designs at the leading edge are digital. In fact, there are mixed-signal components in designs at almost all nodes down to 10/7nm. This may seem surprising because analog scaling has been an issue since about 90nm, but these are not traditional analog components. Analog IP increasingly includes highly integrated, mix... » read more

Blog Review: Jan. 3


Ansys' Steve Pytel argues that increased signaling speeds and frequencies have led to signal integrity issues that circuit simulation alone cannot handle. Cadence's Paul McLellan dives into the details of Intel's 10nm process, including three layers of self-aligned quadruple patterning, contact-over-active-gate, and cobalt for contact fill. Mentor's Ron Press and Vidya Neerkundar argue th... » read more

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