The Week In Review: Manufacturing


Chipmakers Toshiba’s problems have gone from bad to worse. “Toshiba postponed its earnings call by up to one month, and the chairman resigned. The provisional results show large losses in its nuclear power business, while the NAND operations remain very profitable,” said Weston Twigg, an analyst with Pacific Crest Securities, in a research note. “The next few months appear very uncerta... » read more

The Week In Review: Manufacturing


Chipmakers 2017 is just getting underway and there appears to be more restructuring in the IC industry. Toshiba is looking to spin off its semiconductor division and Western Digital (WD) plans to take a minority stake, according to Nikkei, which added that Toshiba would sell a 20% stake for 200-300 billion yen ($1.78-$2.65 billion). “The arrangement would provide Toshiba with short term fund... » read more

5 Takeaways From ISS


At the recent Industry Strategy Symposium (ISS) in Half Moon Bay, Calif., there were a multitude of presentations on a number of subjects. The event, sponsored by SEMI, had presentations on the outlook for ICs and equipment. It also discussed the latest business and technology trends. In no particular order, here are my five takeaways from ISS: Bullish outlook Citing an inventory corre... » read more

The Week In Review: Manufacturing


Chipmakers IC Insights has released its rankings of the top 10 pure-play foundries in 2016. TSMC was the largest foundry in terms of sales, followed by GlobalFoundries, UMC, and SMIC, according to IC Insights. TSMC held a 59% share in 2016. According to IC Insights, the three top-10 pure-play foundry companies that displayed the highest growth rates in 2016 were X-Fab (54%), SMIC (31%) and To... » read more

The Week In Review: Manufacturing


Chipmakers As expected, Qualcomm has signed a definitive agreement to acquire NXP. The value of the deal is approximately $47 billion. With the deal, Qualcomm is diversifying from a maturing handset market into the growing automotive, IoT and security sectors, according to Genuity semiconductor analyst Matthew Ramsay, in a recent research note. “Automotive infotainment, ADAS, IoT and ot... » read more

The Week In Review: Manufacturing


Chipmakers At upcoming the 2016 IEEE International Electron Devices Meeting (IEDM) in San Francisco, TSMC will square off against the alliance of IBM, GlobalFoundries and Samsung at 7nm. IEDM will take place Dec. 3-7, 2016. TSMC will present a paper on 7nm finFET technology. Using 193nm immersion and multi-patterning, the 7nm technology features more than three times the gate density and ei... » read more

The Week In Review: Manufacturing


Fab tools Lam Research’s proposed move to acquire KLA-Tencor has been pushed out for the second time. The deal was supposed to be completed by mid-2016. Then, it was pushed out to the third quarter amid regulatory issues. Now, the companies hope to close the deal by the fourth quarter of 2016. “The KLA-Tencor acquisition is expected to close in the December quarter. This reflects another p... » read more

The Week In Review: Manufacturing


Chipmakers Samsung Electronics has unveiled its newest memory card globally–the EVO Plus 256GB microSD card. Based on Samsung’s 3D NAND technology, the EVO Plus 256-GB offers the highest capacity for a microSD card in its class. Consumers can now record up to 12 hours of 4K UHD video or 33 hours of Full HD video on their mobile device or action camera without needing to change or replace t... » read more

The Week In Review: Manufacturing


Chipmakers IC Insights released its foundry rankings in terms of sales in 2015. TSMC was the leader with $26.4 billion in sales last year. Second ranked GlobalFoundries, which took over IBM’s IC business in 2015, made some gains. With IBM’s chip unit, GlobalFoundries’ quarterly sales in 4Q ‘15 were about $1.4 billion, an annual run-rate of $5.6 billion, about 12% greater than the compa... » read more

The Week In Review: Manufacturing


Chipmakers As reported, Samsung is expanding its efforts in the foundry business, a move that will put the company on a collision course with TSMC and others. Samsung's foundry unit is expanding is logic portfolio and moving into the specialty foundry front. It will also make its advanced packaging technology available, such as 2.5D interposers, to customers. In a blog, Samsung said it plans t... » read more

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