Higher Performance, Lower Power Everywhere


The future of technology is all about information—not just data—at our fingertips, anywhere and at any time. But making all of this work properly will require massive improvements in both performance and power efficiency. There are several distinct pieces to this picture. One is architectural, which is possibly the simplest to understand, the most technologically challenging to realize, ... » read more

Early Chip-Package-System Thermal Analysis


Next-generation automotive, HPC and networking applications are pushing the requirements of thermal integrity and reliability, as they need to operate in extreme conditions for extended periods of time. FinFET designs have high dynamic power density, and power directly impacts the thermal signature of the chip. Thermal degradation typically occurs over an extended period of chip operation. ... » read more

New Market Drivers


Semiconductor Engineering sat down to discuss changing market dynamics with Steve Mensor, vice president of marketing for [getentity id="22926" e_name="Achronix"]; Apurva Kalia, vice president of R&D in the System and Verification group of [getentity id="22032" e_name="Cadence"]; Mohammed Kassem, CTO for [getentity id="22910" comment="efabless"]; Matthew Ballance, product engineer and techn... » read more

Designing 5G Chips


5G is the wireless technology of the future, and it’s coming fast. The technology boasts very high-speed data transfer rates, much lower latency than 4G LTE, and the ability to handle significantly higher densities of devices per cell site. In short, it is the best technology for the massive amount of data that will be generated by sensors in cars, IoT devices, and a growing list of next-g... » read more

Aging Models: The Basis For Predicting Circuit Reliability


Today, many products are based on high-performance electronic systems and integrated circuits (ICs), and the importance of these elements is ever-increasing. A certain tension arises here as these applications often call for a large amount of processing power and reliability. The processing power can best be supplied with highly scaled semiconductor technologies. However, these manufacturing te... » read more

Chipping Away At Functional Safety Flaws In Automotive Electronics


Today’s automobiles are packed with electronics. From autonomous driving support and infotainment systems to mission-critical functions like braking, a car’s performance depends on the reliability of these electronics systems. While the semiconductors that lie at the heart of these systems have been not been a focus in the past, today their reliability is coming under closer scrutiny by bot... » read more

New Market Drivers


Semiconductor Engineering sat down to discuss changing market dynamics with Steve Mensor, vice president of marketing for [getentity id="22926" e_name="Achronix"]; Apurva Kalia, vice president of R&D in the System and Verification group of [getentity id="22032" e_name="Cadence"]; Mohammed Kassem, CTO for [getentity id="22910" comment="efabless"]; Matthew Ballance, product engineer and techn... » read more

Smaller, Faster, Cheaper—But Different


The old mantra of "smaller, faster, cheaper" has migrated from the chip level to the electronic system level, raising some interesting questions about where the real value is being generated. Smaller as it pertains to gate size, line widths and spaces, will continue in an almost straight line for at least the next decade. The ability to print three-dimensional features on a nanoscale using E... » read more

Is Advanced Packaging The Next SoC?


Device scaling appears to be possible down to 1.2nm, and maybe even beyond that. What isn't obvious is when scaling will reach that node, how many companies will actually use it, or even what chips will look like when foundries actually start turning out these devices using multi-patterning with high-NA EUV and dielectrics with single-digit numbers of atoms. There are two big changes playing... » read more

Finding Faulty Auto Chips


The next wave of automotive chips for assisted and autonomous driving is fueling the development of new approaches in a critical field called outlier detection. KLA-Tencor, Optimal+, as well as Mentor, a Siemens Business, and others are entering or expanding their efforts in the outlier detection market or related fields. Used in various industries for several years, outlier detection is one... » read more

← Older posts