The Week In Review: Design


Tools Synopsys revealed a comprehensive low power reference kit for design and verification based on a bitcoin mining SoC design. The kit is designed to help accelerate deployment of a Unified Power Format (UPF)-based hierarchical design methodology and as a learning vehicle for the complete Synopsys low power flow. Space Codesign introduced the latest version of its simulation environmen... » read more

Big Data On Wheels


By Jeff Dorsch & Ed Sperling All kinds of chips are going into driver-assisted and autonomous cars. On one side are arrays of sensors, which are generating huge amounts of data about everything from lane position and proximity to other cars to unexpected objects in the road. On the other side are the chips required to process that data at blazing speed. As the market for PCs and mobil... » read more

What’s Next For NOR Flash?


The flash memory market is the tale two of cities. Today, NAND and NOR are the two main flash memory types. Over the years, the NAND flash market has exploded. Targeted for data storage, NAND flash has moved into flash cards, solid-state storage drives (SSDs) and other products. The excitement for NAND continues to mount, as the technology is moving from planar to a 3D structure. In fact, 3D... » read more

New Embedded Memories Ahead


The embedded memory market is beginning to heat up, fueled by a new wave of microcontrollers (MCUs) and related chips that will likely require new and more capable nonvolatile memory types. The industry is moving on several different fronts in the embedded memory landscape. On one front, traditional solutions are advancing. On another front, several vendors are positioning the next-generatio... » read more

IoT Security Risks Grow


Semiconductor Engineering sat down to discuss security issues with Asaf Shen, vice president of marketing for security IP in ARM's Systems & Software Group; Timothy Dry, principal staff marketing manager for the Industrial IoT segment at GlobalFoundries; Chowdary Yanamadala, senior vice president of business development at ChaoLogix; and Eric Sivertson, CEO of Quantum Trace. What follows ar... » read more

Embedded Software Verification Issues Grow


Embedded software is becoming more critical in managing the power and performance of complex designs, but so far there is no consensus about the best way to approach it—and that's creating problems. Even with safety-critical standards such as DO-178C for aerospace and [gettech id="31076" comment="ISO 26262"] for automotive, different groups of tool providers approach software from differen... » read more

Can Low-Power Devices Be Secure?


Successfully designing a low-power, high-performance chip design is an accomplishment, but effectively implementing cybersecurity in such devices makes it much more difficult. Safety, particularly functional safety for automotive and military/aerospace applications, also can be a prime concern in creating low-power, high-performance integrated circuits and systems. When combined with securit... » read more

Securing The IoT


Last week’s massive distributed denial-of-service attack, directed at Dyn DNS—a small New Hampshire-based company that operates part of the Internet’s Domain Name System—brought many popular websites to a crawl. Among those affected were such giants as Airbnb, Reddit, Twitter, Amazon and Netflix. The Internet outages spread from the East Coast of the United States to the rest of the ... » read more

Seeing The Future Of Vision


Vision systems have evolved from cameras that enable robots to “see” on a factory floor to a safety-critical element of the heterogeneous systems guiding autonomous vehicles, as well as other applications that call for parallel processing technology to quickly recognize objects, people, and the surrounding environment. Automotive electronics and mobile devices currently dominate embedded... » read more

The Week In Review: Manufacturing


Fab tools and T&M Applied Materials and the Institute of Microelectronics (IME), a research institute under the Agency for Science, Technology and Research (A*STAR), have announced a five-year extension of their R&D collaboration at the Centre of Excellence in Advanced Packaging in Singapore. The organizations will expand the scope of their R&D collaboration to focus on advancing fan-out wafer... » read more

← Older posts