Inside Advanced Packaging

Semiconductor Engineering sat down to discuss advanced IC-packaging, the OSAT industry, China and other topics with Ron Huemoeller, vice president of worldwide R&D at Amkor. What follows are excerpts of that conversation. SE: Where are we in advanced IC-packaging today? Huemoeller: We’ve hit the inflection point. Now we are coming to the other side of it. Regarding this need to int... » read more

A Faster, More Accurate Approach For System-Level Performance Verification Of A Wireless RFIC Design

Wireless RFIC designs are growing more complex, increasing the challenge of verifying system-level performance. Designers are expected to be experts on a variety of ever-changing wireless standards and protocols. They must also contend with time-consuming manual simulation setup and post-processing of the simulation results. This paper discusses how an advanced simulation methodology, involving... » read more