Grappling With Manufacturing Data


As complexity goes up with each new process node, so does the amount of data that is generated, from initial GDSII to photomasks, manufacturing, yield and post-silicon validation. But what happens to that data, and what gets shared, remain a point of contention among companies across the semiconductor ecosystem. The problem is that to speed up the entire design through manufacturing process,... » read more

Data Analytics To Drive IC Shift


The adoption of predictive analytics has the potential to drive the next round of IC industry innovation and growth. Much of the necessary data handling technology is now available from other sectors. However, to fully capitalize on the possibilities, the IC manufacturing world faces particular challenges in figuring out how to get a high yield of actionable information from its streams of vari... » read more

Fab Tool Biz Looks Cloudy


Amid a slowdown in the foundry and DRAM sectors, the outlook for the semiconductor equipment industry looks somewhat cloudy, if not challenging, in 2016. In fact, for equipment vendors, 2016 could resemble the lackluster year in 2015. In 2015, for example, capital spending in the foundry sector fell during the year, although NAND flash began to pick up steam. In 2015, though, the big stor... » read more

The Week In Review: Manufacturing


Upgraded components in the new iPhone 6S Plus from Apple cost $16 more than the components in the earlier iPhone 6 Plus, according to IHS, which also provided a breakdown of the phone. Both Samsung and TSMC are making Apple’s A9 applications processor on a foundry basis, according to ExtremeTech, which cites Chipworks as its source. There are reports that the Chinese government is interes... » read more

Advanced IC Packaging Biz Heats Up


After a number of false starts and lackluster adoption, the advanced IC packaging market is finally heating up. On one front, for example, a new wave of chips based on advanced [getkc id="82" kc_name="2.5D"]/[getkc id="42" kc_name="3D"] stacked-die is entering the market. And on another front, the momentum is building for new and advanced 2D packages, such as embedded package-on-package (PoP... » read more