Five Trends In IC Packaging


At one time, chip packaging was an afterthought. Chipmakers were more worried about IC design. Packaging was considered a mere commodity, which was simply used to house the design. More recently, though, chip packaging has become a hot topic. The IC design is still important, but packaging is a key part of the solution. In fact, the industry can go down two paths. The traditional way is t... » read more

What’s Next For Atomic Layer Etch?


After years in R&D, several fab tool vendors last year finally began to ship systems based a next-generation technology called atomic layer etch (ALE). [getkc id="284" kc_name="ALE"] is is moving into 16/14nm, but it will play a big role at 10/7nm and beyond. The industry also is working on the next wave of ALE technology for advanced logic and memory production. Used by chipmakers fo... » read more

The Week In Review: Manufacturing


Packaging and test A*STAR’s Institute of Microelectronics (IME) has formed a fan-out wafer-level packaging consortium comprising of OSATs, materials vendors, equipment suppliers and others. The group is called the FOWLP Development Line Consortium. As part of the announcement, Singapore’s IME has established a development line to accelerate the development of fan-out. Located in IME’s... » read more

Litho Options For Panel Fan-out


Several packaging houses are inching closer to production of panel-level fan-out packaging, a next-generation technology that promises to reduce the cost of today’s fan-out packages. In fact, ASE, Nepes, Samsung and others already have installed the equipment in their panel-level fan-out lines with production slated for 2018 or so. But behind the scenes, panel-level packaging houses contin... » read more

Chiplets Gaining Steam


Building chips from pre-verified chiplets is beginning to gain traction as a way of cutting costs and reducing time to market for heterogeneous designs. The chiplet concept has been on the drawing board for some time, but it has been viewed more as a possible future direction than a necessary solution. That perception is beginning to change as complexity rises, particularly at advanced nodes... » read more

The Week In Review: Manufacturing


Chipmakers Bloomberg has reported that Broadcom is in talks to acquire Qualcomm for $70 per share or about $90 billion. Qualcomm is attempting to acquire NXP, but Broadcom has its sights on Qualcomm, not NXP. “We think AVGO would want to acquire QCOM assets not NXP,” said Amit Daryanani, an analyst with RBC. Samsung continues to reshuffle its management amid a plethora of changes at t... » read more

The Week in Review: IoT


Finance Farmobile has raised $18.1 million in a Series B round of funding, led by Anterra Capital and AmTrust Agricultural Insurance Services, bringing its total funding to more than $28 million. Existing investors also took part in the new round. The agricultural Internet of Things startup will use the money to expand its operations around the world. Farmobile provides agronomic and machine d... » read more

The Week In Review: Manufacturing


Chipmakers At this week’s International Wafer-Level Packaging Conference (IWLPC), Samsung disclosed details about its efforts in the panel-level fan-out market. Samsung as well as ASE, Nepes and others are developing a next-generation fan-out technology using a panel-level format. In panel-level fan-out packaging, you can put more die on a panel as compared to a traditional round wafer, w... » read more

The Week In Review: Manufacturing


Market research The IC market remains hot, as several market researchers are raising their forecasts--again. Gartner recently raised its overall IC forecast. Now, IC Insights has raised its IC market growth rate forecast for 2017 to 22%, up six percentage points from the 16% increase shown in its mid-year update. In March, IC Insights raised its worldwide IC market growth forecast for 201... » read more

Next-Gen Mask Writer Race Begins


Competition is heating up in the mask writer equipment business as two vendors—Intel/IMS and NuFlare—vie for position in the new and emerging multi-beam tool segment. Last year, Intel surprised the industry by acquiring IMS Nanofabrication, a multi-beam e-beam mask writer equipment vendor. Also last year, IMS, now part of Intel, began shipping the world’s first multi-beam mask writer f... » read more

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