The Week In Review: Manufacturing


Chipmakers China’s IC industry is embarking on a recruitment drive to prepare for the operation of new fabs in 2018, according to TrendForce. “TrendForce’s latest analysis on China’s semiconductor sector reveals that the country’s domestic IC manufacturers are affecting the movement of industry talent worldwide as they continue to aggressively headhunt for senior managers and enginee... » read more

The Week In Review: Design


Tools Synopsys revealed a comprehensive low power reference kit for design and verification based on a bitcoin mining SoC design. The kit is designed to help accelerate deployment of a Unified Power Format (UPF)-based hierarchical design methodology and as a learning vehicle for the complete Synopsys low power flow. Space Codesign introduced the latest version of its simulation environmen... » read more

The Week In Review: Manufacturing


Chipmakers At this week’s TSMC Technology Symposium in San Jose, Calif., TSMC rolled out a dizzying array of new processes and technologies. Perhaps the most surprising announcement was a 22nm bulk CMOS process, which is geared for ultra low-power planar chips. The technology will compete against a 22nm FD-SOI technology from GlobalFoundries. Stay tuned. The battle has just begun. As e... » read more

China: Fab Boom or Bust?


China’s semiconductor industry continues to expand at a frenetic pace. At present there are nearly two dozen new fab projects in China. Whether all these fab projects get off the ground is not entirely clear because the dynamics in China remain fluid. What is clear is the motivation behind this building frenzy—China is trying to reduce its huge trade imbalance in ICs. The country continu... » read more

Quality Issues Widen


As the amount of semiconductor content in cars, medical and industrial applications increases, so does the concern about how long these devices will function properly—and what exactly that means. Quality is frequently a fuzzy concept. In mobile phones, problems have ranged from bad antenna placement, which resulted in batteries draining too quickly, to features that take too long to load. ... » read more

2.5D Adds Test Challenges


OSATs and ATE vendors are making progress in determining what works and what doesn't in 2.5D packaging, expanding their knowledge base as this evolves into a mainstream technology. A [getkc id="82" kc_name="2.5D"] package generally includes an ASIC connected to a stack of memory chips—usually high-bandwidth memory—using an [getkc id="204" kc_name="interposer"] or some type of silicon bri... » read more

The Week In Review: Manufacturing


SPIE news At this week’s SPIE Advanced Lithography conference, the industry paid close attention to the progress of extreme ultraviolet (EUV) lithography. Here’s the general report card: EUV is making noticeable progress, but there are still some challenges ahead, such as the power source, resists and pellicles. Several issues need to be resolved before chipmakers can put EUV into mass... » read more

The Week In Review: Manufacturing


Chipmakers Recently, Intel announced plans to invest more than $7 billion to complete its previously-announced fab in Chandler, Ariz. Targeted for 7nm processes, Fab 42 will be completed in 3 to 4 years. As reported, the fab announcement was made by U.S. President Donald Trump and Intel CEO Brian Krzanich at the White House. There is more to the story. Typically, Intel has two fabs for a gi... » read more

The Week In Review: Design


M&A ARM made two acquisitions to add the new NarrowBand-IoT (NB-IoT) low power wide area connectivity standard to its designs: Mistbase, founded in 2015 in Sweden, provides a complete NB-IoT physical layer implementation solution, while London-based NextG-Com, founded in 2008, offers a complete layer two and three software stack for NB-IoT. Tools Synopsys released the latest versio... » read more

Advanced ASICs Are A Team Sport


The recent Super Bowl proved that a team with conviction and focus can do anything. This notion comes in handy when you think about the nearly impossible job of designing and manufacturing an advanced ASIC – in finFET technologies, with an interposer, multiple die, and never-before-proven throughput rates. For these kind of advanced technologies, it does take a village. What works is open, tr... » read more

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