Five Trends In IC Packaging


At one time, chip packaging was an afterthought. Chipmakers were more worried about IC design. Packaging was considered a mere commodity, which was simply used to house the design. More recently, though, chip packaging has become a hot topic. The IC design is still important, but packaging is a key part of the solution. In fact, the industry can go down two paths. The traditional way is t... » read more

The Week In Review: Manufacturing


Test, measurement and fab tools National Instruments (NI) has released a report that explores the future trends in the electronics industry. The report, called the NI Trend Watch 2018, looks at the technological advances and some of the biggest challenges engineers face in 2018. The report from NI looks at the following topics—machine learning; test challenges for 5G; IIoT; and effects of... » read more

Memory Market: More Than ASPs At Risk


By Adrienne Downey and Jim Feldhan In June 2016, the memory market emerged from its slump after reversing its 12-month ASP decline. Since then, we’ve seen a strong rebound for ASPs in both DRAM and NAND. Contributing to this recovery was the increasing demand in memory content per device across all end markets combined with a more controlled capital investment over the past several years.... » read more

The Week In Review: Manufacturing


Chipmakers Alain Kaloyeros, president of SUNY Polytechnic Institute, has resigned. This comes amid charges that Kaloyeros was involved in an alleged bid-rigging scheme, according to multiple reports. SUNY Poly, a high-tech educational ecosystem in New York, was recently formed from the merger of the SUNY College of Nanoscale Science and Engineering (CNSE) and the SUNY Institute of Technology. ... » read more

The Week In Review: Manufacturing


Fab tools Lam Research’s proposed move to acquire KLA-Tencor has been pushed out for the second time. The deal was supposed to be completed by mid-2016. Then, it was pushed out to the third quarter amid regulatory issues. Now, the companies hope to close the deal by the fourth quarter of 2016. “The KLA-Tencor acquisition is expected to close in the December quarter. This reflects another p... » read more

Is 450mm Dead In The Water?


At one time, Intel, TSMC and Samsung were aggressively beating the 450mm drum. Chipmakers wanted, if not demanded, 450mm pilot line fabs by 2016, with high-volume manufacturing 450mm plants slated by 2018. At least for those companies, 450mm made some sense. Moving to 450mm wafers would supposedly give chipmakers a 2.25x boost in wafer area and a 30% cost reduction over 300mm substrates. But... » read more

Smarter Lights


New products targeting the emerging Smart Home Automation market are popping up every day. There are smart locks, smart thermostats, smart refrigerators, smart mirrors, and the list just goes on and on. Sooner or later, we, as consumers, will have to determine how all this smart technology will enter our homes. What will be the main gateway providing access to all this Smart Home Automation?... » read more

Experts At The Table: IP Subsystems


By Ed Sperling Semiconductor Manufacturing & Design sat down to discuss the transition to IP subsystems with Kevin Meyer, vice president of design enablement strategy and alliances at GlobalFoundries; Steve Roddy, vice president of marketing at Tensilica; Mike Gianfagna, vice president of marketing at Atrenta; and Adam Kablanian, CEO of Memoir Systems. What follows are excerpts of that con... » read more

Too Soon For Wide I/O


By Ann Steffora Mutschler When 3D ICs are prevalent, Wide I/O is sure to be there. But where does the technology stand today? Considering the amount of buzz and hype, it would be easy believe it is being implemented in production designs today. Wide I/O is a very brute-force way of solving the problem of trying to get latency down with a high-speed memory interface, explained Navraj Nandra,... » read more

IP Subsystems Are Nothing New


By Kurt Shuler I’ve been hearing the term “IP subsystem” lately, and it seems to be the latest newfangled buzz word in the SoC semiconductor and IP industry, second only to “virtualization.” Much of the context for this growing interest in IP subsystems has been inspired from the work of Rich Wawrzyniak in his Semico Research report, “IP Subsystems: The Next IP Market Paradigm - Oc... » read more