The Week In Review: Manufacturing


Chipmakers Alain Kaloyeros, president of SUNY Polytechnic Institute, has resigned. This comes amid charges that Kaloyeros was involved in an alleged bid-rigging scheme, according to multiple reports. SUNY Poly, a high-tech educational ecosystem in New York, was recently formed from the merger of the SUNY College of Nanoscale Science and Engineering (CNSE) and the SUNY Institute of Technology. ... » read more

The Week In Review: Manufacturing


Fab tools Lam Research’s proposed move to acquire KLA-Tencor has been pushed out for the second time. The deal was supposed to be completed by mid-2016. Then, it was pushed out to the third quarter amid regulatory issues. Now, the companies hope to close the deal by the fourth quarter of 2016. “The KLA-Tencor acquisition is expected to close in the December quarter. This reflects another p... » read more

Is 450mm Dead In The Water?


At one time, Intel, TSMC and Samsung were aggressively beating the 450mm drum. Chipmakers wanted, if not demanded, 450mm pilot line fabs by 2016, with high-volume manufacturing 450mm plants slated by 2018. At least for those companies, 450mm made some sense. Moving to 450mm wafers would supposedly give chipmakers a 2.25x boost in wafer area and a 30% cost reduction over 300mm substrates. But... » read more

Smarter Lights


New products targeting the emerging Smart Home Automation market are popping up every day. There are smart locks, smart thermostats, smart refrigerators, smart mirrors, and the list just goes on and on. Sooner or later, we, as consumers, will have to determine how all this smart technology will enter our homes. What will be the main gateway providing access to all this Smart Home Automation?... » read more

Experts At The Table: IP Subsystems


By Ed Sperling Semiconductor Manufacturing & Design sat down to discuss the transition to IP subsystems with Kevin Meyer, vice president of design enablement strategy and alliances at GlobalFoundries; Steve Roddy, vice president of marketing at Tensilica; Mike Gianfagna, vice president of marketing at Atrenta; and Adam Kablanian, CEO of Memoir Systems. What follows are excerpts of that con... » read more

Too Soon For Wide I/O


By Ann Steffora Mutschler When 3D ICs are prevalent, Wide I/O is sure to be there. But where does the technology stand today? Considering the amount of buzz and hype, it would be easy believe it is being implemented in production designs today. Wide I/O is a very brute-force way of solving the problem of trying to get latency down with a high-speed memory interface, explained Navraj Nandra,... » read more

IP Subsystems Are Nothing New


By Kurt Shuler I’ve been hearing the term “IP subsystem” lately, and it seems to be the latest newfangled buzz word in the SoC semiconductor and IP industry, second only to “virtualization.” Much of the context for this growing interest in IP subsystems has been inspired from the work of Rich Wawrzyniak in his Semico Research report, “IP Subsystems: The Next IP Market Paradigm - Oc... » read more