Packaging Challenges For 2018

The IC packaging market is projected to see steady growth this year, amid ongoing changes in the landscape. The outsourced semiconductor assembly and test ([getkc id="83" kc_name="OSAT"]) industry, which provides third-party packaging and test services, has been consolidating for some time. So while sales rising, the number of companies is falling. In late 2017, for example, [getentity id="2... » read more

Fab Capacity Shortages

Planning fab capacity is a little like parachuting out of an airplane. Your chances of getting hurt are 50-50 every time you jump, and past experience doesn't necessarily make it safer the next time. At the leading edge, there is debate about just how much capacity should be added at 16/14nm, or whether the lion's share of that investment should go to 10nm or even 7nm. At least part of the d... » read more