ON Semiconductor Meets AEC Challenges With Electrothermal Analysis


By Justin Yerger, ON Semiconductor, and Ahmed Eisawy, Mentor, a Siemens Business ON Semiconductor is a leading provider of products for automotive applications that follow the Automotive Electronics Council (AEC Q-100-012) requirements for reliability characterization of smart power devices. In particular, Automotive Smart FET driver ICs present verification challenges when verifying short c... » read more

Verification In The Cloud


By Ed Sperling Leasing of cloud-based verification resources on an as-needed basis is finally beginning to gain traction after more than a decade of false starts and over-optimistic expectations. All of the major EDA vendors now offer cloud-based services. They view this as a way of either supplementing a chipmaker's existing resources at various peak use times, or for small and midsize com... » read more

Hybrid Emulation


Semiconductor Engineering sat down to discuss the growing usage of hybrid verification approaches with Frank Schirrmeister, senior group director of product management & marketing for [getentity id="22032" e_name="Cadence"]; Russ Klein, program director for pre-silicon debug products at [getentity id="22017" e_name="Mentor, a Siemens Business"]; [getperson id="11027" comment="Phil Moorby"],... » read more

Introducing An Embedded Multicore Framework For Advanced AMP Architectures


Heterogeneous multicore systems, that combine two or more microprocessors, are quickly becoming the de-facto architecture in the embedded industry. The asynchronous multiprocessing (AMP) software architecture enables designers to leverage the compute bandwidth provided by these heterogeneous processors. The best way to fully realize the potential of an AMP architecture is to implement it within... » read more

Blog Review: June 28


Mentor's Craig Armenti notes the benefits, and challenges, of investing in modular design in the PCB domain. Cadence's Paul McLellan covers a DAC chat with CEO Lip-Bu Tan on the rise of advanced packaging and investments in AI and autonomous driving. Synopsys' Jim Hartnett examines some of the challenges and tradeoffs involved in building good security practices in hospital environments. ... » read more

Safety Plus Security: Solutions And Methodologies


By Ed Sperling & Brian Bailey As more technology makes its way into safety-critical markets—and as more of those devices are connected to the Internet—security issues are beginning to merge with safety issues. The number of attempted cyberattacks is up on every front, which has big implications for devices used in safety-related applications. There are more viruses, ransomware, an... » read more

Wednesday At DAC


Wednesday at DAC started off in usual fashion with a keynote. For the third day, the focus of the talk was the IoT and how significant the change is going to be. Tyson Tuttle, CEO of Silicon Labs, was the speaker. While there are a lot of figures about how many devices will be connected in the future, Tuttle put it into a different perspective. "There will 70B connected devices by 2025 worth $... » read more

Verification Unification


Semiconductor Engineering brought together industry luminaries to initiate the discussion about the role that formal technologies will play with Portable Stimulus and how it may help to bring the two execution technologies closer together. Participating in this roundtable are Joe Hupcey, verification product technologist for [getentity id="22017" e_name="Mentor, a Siemens Business"]; Tom Fitzpa... » read more

Tuesday At DAC


Accellera got everyone out of bed early this morning to talk about the just announced early access release of Portable Stimulus. The panel was made up with people from user companies. Semiconductor Engineering will be providing full coverage of this event, but perhaps the important message is that the panelists were eager to get adoption within their companies but knew that there would be chall... » read more

Blog Review: June 21


Mentor's John McMillan looks into the unique form-factors and components influencing IoT PCB designs. Cadence's Paul McLellan notes some big topics at the Samsung Foundry Forum: FD-SOI, embedded MRAM, and which gate-all-around FET architecture may be the winner. Synopsys' Eric Huang has a lighthearted look at why to buy IP versus building it. Rambus' Aharon Etengoff points to another U... » read more

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