Aeponyx: Optical Chips For Telecom


As the amount of data grows, so does interest in silicon photonics. There is no better way to move data than with light. It's faster, requires less energy, and generates less heat. The main trouble spots come in two places—packaging the light source with another chip, and the switching technology from optical to electrical and back to optical. While companies like Intel have been working o... » read more

System Bits: Oct. 24


Optical communication on silicon chips With the huge increase in computing performance in recent decades achieved by squeezing ever more transistors into a tighter space on microchips, at the same time this downsizing has also meant packing the wiring within microprocessors ever more tightly together. This has led to effects such as signal leakage between components, which can slow down commun... » read more

Light In A Package


Silicon photonics is gaining significant traction inside the data center, but creating a simpler method of packaging the laser with other circuitry remains a stumbling block for cutting costs and using this technology across a wider swath of applications. Progress does appear to be on the horizon, even though exact time frames remain unclear. The advantages of light in communications are wel... » read more

Executive Insight: Lip-Bu Tan


Semiconductor Engineering sat down with Lip-Bu Tan, president and CEO of [getentity id="22032" e_name="Cadence"], to discuss disruptions and changes in the semiconductor industry, from machine learning and advance packaging to tools and business. What follows are excerpts of that conversation. SE: What do you see as the next big thing? Tan: Unlike mobility or cell phones, or PCs before th... » read more

Integrated Photonics


Semiconductor Engineering sat down to discuss the status of integrated photonics with Twan Korthorst, CEO for PhoeniX Software; Gilles Lamant, distinguished engineer for [getentity id="22032" e_name="Cadence"]; Bill De Vries, director of marketing for Lumerical Solutions; and Brett Attaway, director of EPDA solutions at AIM Photonics, SUNY Polytechnic Institute. What follows are excerpts of tha... » read more

Silicon Photonics: Solving Process Variation And Manufacturing Challenges


As silicon photonics manufacturing gains momentum with additional foundry and 300mm offerings, process variation issues are coming to light. Variability in silicon processing affects the waveguide shape and can result in deviation in effective indices, propagation loss, and coupling efficiency from the intended design. In this article, we will highlight process variation issues that can occur i... » read more

What’s Next In Scaling, Stacking


An Steegen, executive vice president of semiconductor technology and systems at [getentity id="22217" e_name="Imec"], sat down with Semiconductor Engineering to discuss IC scaling, chip stacking, packaging and other topics. Imec is an R&D organization in Belgium. What follows are excerpts of that conversation. SE: Chipmakers are shipping 16nm/14nm processes with 10nm and 7nm technologies... » read more

Achieving The Vision Of Silicon Photonics Processing


With the increasing need for faster data transfer rates, the transition from electrical to optical signaling in data processing is inevitable. Copper cabling cannot keep up with the upcoming data center bandwidth requirements for applications such as multimedia streaming and high performance computing. One technology that could enable true optical communication is silicon photonics. Silicon is ... » read more

Focus Shifting To Photonics


Silicon photonics finally appears ready for prime time, after years of unfulfilled expectations and a vision that stretches back at least a couple decades. The biggest challenge has been the ability to build a light source directly into the silicon process, rather than trying to add one onto a chip after manufacturing. [getentity id="22846" e_name="Intel"] today said it has achieved that mi... » read more

Advanced Packaging Is Real. Now What?


For the past five years, it's been clear that 2.5D, fan-outs and other forms of system-in-package were on the horizon. Exactly when they would arrive no one knew. The most common prediction was that the timing would depend on when one of the big chipmakers decided to go down that route. The theory was that the remainder of the industry would follow, ecosystem issues would be sorted out—partic... » read more

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