Fault Simulation Reborn


Fault simulation, one of the oldest tools in the EDA industry toolbox, is receiving a serious facelift after it almost faded from existence. In the early days, fault simulation was used to grade the quality of manufacturing test vectors. That task was replaced almost entirely by [getkc id="173" comment="scan test"] and automatic test pattern generation (ATPG). Today, functional safety is cau... » read more

Massive SoC Designs Open Doors To New Era In Simulation


As system-on-chip (SoC) designs have grown in size, simulation technologies have had to evolve dramatically to keep pace. We’re now at an inflection point where both speed and capacity are essential and new simulation technologies are needed to meet the demands. In this paper, we’ll discuss how simulation has evolved and examine how new technologies such as the Cadence RocketSimTM Parallel ... » read more

Test More Complex For Cars, IoT


With increasing focus on safety-critical semiconductors—driven by ADAS, IoT, and security—functional safety concerns are going through the roof. Engineering teams are scrambling to determine how to conduct better in-field or online testing because test no longer can be an afterthought. This has been a common theme across the automotive ecosystem for the past few years, and as the automot... » read more

Confidence In 7nm Designs Requires Multi-Variable, Multi-Scenario Analysis


As designs move toward 7-nanometer (nm) process nodes, engineering and production cost dramatically increases and the stake in getting the design right the first time becomes significantly higher than ever before. You are faced with the question, “how confident are you in your design analysis coverage?” Tighter noise margin, increasing power density, faster switching current and greater ... » read more

Electrothermal Mechanical Stress Reference Design Flow For Printed Circuit Boards And Electronic Packages


This paper presents a reference design flow for solving the electrical, thermal and mechanical challenges of a printed circuit board (PCB) using simulation tools from ANSYS. This approach can be utilized for all electrical CAD (ECAD) types such as IC packages, touch panel displays, and glass and silicon interposers. The authors followed this reference design flow for analyzing a PCB virtual pro... » read more

Uncovering Unintended Behavior


Very few companies ever had to worry about security until recently. Over the past couple of years, we have seen increasing evidence that our connected systems are vulnerable. The recent distributed denial of service (DDoS) attack, which made many Internet sites unavailable, has focused attention on Internet of Things (IoT) devices such as digital video recorders and cameras that have Internet a... » read more

2017: Tool And Methodology Shifts


As the markets for semiconductor products evolve, so do the tools that enable automation, optimization and verification. While tools rarely go away, they do bend like plants toward light. Today, it is no longer the mobile phone industry that is defining the direction, but automotive and the Internet of Things (IoT). Both of these markets have very different requirements and each creates their o... » read more

New Techniques To Analyze And Reduce Etch Variation


Time division multiplex (TDM) plasma etch processes (commonly referred to as Deep Reactive ION Etching [“DRIE”]) use alternating deposition and etch steps cyclically to produce high aspect ratio structures on a silicon substrate. These etch processes have been widely applied in the manufacturing of silicon MEMS devices, and more recently in creating through silicon vias in 3D silicon struct... » read more

Power-Aware Analysis Solution


By reviewing the classic (or traditional) SI methodology, analyzing high-speed design flow, and examining what is employed in Cadence Sigrity power and signal simulations using the SPEED2000, PowerSI, Transistor-to-Behavioral Model Conversion (T2BTM), and SystemSI tools, this paper explains how a general power-aware SI solution not only should be capable of performing SSN simulations, but also ... » read more

Integrating Process Models With TCAD Simulation…


Novel semiconductor technologies are creating complex process flows, which are needed to support the manufacturing of advanced 3D semiconductor structures. It can be helpful to model process flows, and their effect on a novel device, prior to physical fabrication. Process modeling is a technique that can predict the 3D structure of a device using an understanding of unit process steps. Durin... » read more

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