200mm Crisis?


Over the last year or so, the IC industry has experienced an acute shortage of both 200mm fab capacity and 200mm equipment amid a surge of demand for certain chips. Right now, though, the 200mm shortfall is much worse than before. But this situation isn’t expected to improve for both elements in the second half of 2017, and perhaps beyond. On the capacity front, chipmakers are generally... » read more

The Week In Review: Manufacturing


Market research Intel held a slim 4% lead over Samsung for the number one position in terms of chip sales in the first quarter, according to IC Insights. But as reported, Samsung is on pace to displace Intel as the world’s largest semiconductor supplier in the second quarter, according to the firm. Meanwhile, in the ranking, SK Hynix and Micron made the biggest moves. And there was one new e... » read more

The Week In Review: Manufacturing


Fab equipment and test VLSI Research has released its top 10 semiconductor equipment supplier ranking in terms of sales in 2016. Applied Materials topped the list again, achieving a growth of 18%. ASML was second, followed by Lam Research, TEL and KLA-Tencor. Fig. 1: Ranking based on 2016 sales. Source: VLSI Research. Unic Capital Management, a Chinese-based private equity fund, announ... » read more

The Week In Review: Manufacturing


Chipmakers At an event, Intel’s Technology and Manufacturing group outlined the company's vision. As part of the event, Intel reiterated what many are saying—the current node designations are meaningless and misleading. “For example, Intel estimates that its 14nm solution that has been out in the market since 2014 should be equal to 10nm solutions released by competitors in the near futu... » read more

China: Fab Boom or Bust?


China’s semiconductor industry continues to expand at a frenetic pace. At present there are nearly two dozen new fab projects in China. Whether all these fab projects get off the ground is not entirely clear because the dynamics in China remain fluid. What is clear is the motivation behind this building frenzy—China is trying to reduce its huge trade imbalance in ICs. The country continu... » read more

2.5D Adds Test Challenges


OSATs and ATE vendors are making progress in determining what works and what doesn't in 2.5D packaging, expanding their knowledge base as this evolves into a mainstream technology. A [getkc id="82" kc_name="2.5D"] package generally includes an ASIC connected to a stack of memory chips—usually high-bandwidth memory—using an [getkc id="204" kc_name="interposer"] or some type of silicon bri... » read more

Semiconductor CapEx To Increase 4.3% In 2017


Semiconductor capital expenditures are an important bellwether for the industry. Based on preliminary findings, Semico Research predicts 2017’s total will increase 4.3% to $69.7 billion, a record high, and a slightly larger increase than in 2016. Semico tracks more than 80 companies for CapEx and R&D spending, although many of those companies have merged, have been acquired, or gone ba... » read more

The Week In Review: Manufacturing


Chipmakers Intel has announced plans to invest more than $7 billion to complete its previously-announced fab in Chandler, Ariz. The fab was announced several years ago, but Intel delayed the plant in 2014. Now, the plant, dubbed Fab 42, is moving forward again. Targeted for 7nm technology, Fab 42 will be completed in 3 to 4 years and will create approximately 3,000 jobs. The announcement was m... » read more

The Week In Review: Manufacturing


Chipmakers 2017 is just getting underway and there appears to be more restructuring in the IC industry. Toshiba is looking to spin off its semiconductor division and Western Digital (WD) plans to take a minority stake, according to Nikkei, which added that Toshiba would sell a 20% stake for 200-300 billion yen ($1.78-$2.65 billion). “The arrangement would provide Toshiba with short term fund... » read more

China Unveils Memory Plans


Backed by billions of dollars in government funding, China in 2014 launched a major initiative to advance its domestic semiconductor, IC-packaging and other electronic sectors. So far, though, the results are mixed. China is making progress in IC-packaging, but the nation’s efforts to advance its domestic logic and memory sectors are still a work in progress. In fact, China has yet to achi... » read more

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