New Architecture Elements For 5G RF Front-End Modules To Reduce Noise, Improve Efficiency, And Allow Multiple Radio Transmitters


A technical paper titled “Circuits for 5G RF front-end modules” was published by researchers at Skyworks Solutions Inc. Abstract: "Worldwide adoption of fourth-generation wireless (4G) long-term evolution (LTE) smartphones and the actual transition to fifth-generation wireless (5G) is the main driving engine for semiconductor industry. 5G is expected to reach high data rate speeds (1 Gbps... » read more

Demand For Timing Innovation Grows


The semiconductor industry has begun exploring a range of timing options as demand for increased performance and more features exceeds the ability to design chips using the same techniques and technology that have been relied on for decades. Like many elements in computing, timing is a hierarchy or stack. It includes everything from partitioning AI computations into multiple parts and assemb... » read more

Coping With Parallel Test Site-to-Site Variation


Testing multiple devices in parallel using the same ATE results in reduced test time and lower costs, but it requires engineering finesse to make it so. Minimizing test measurement variation for each device under test (DUT) is a multi-physics problem, and it's one that is becoming more essential to resolve at each new process node and in multi-chip packages. It requires synchronization of el... » read more

Week In Review: Design, Low Power


Skyworks Solutions will acquire Silicon Labs' Infrastructure & Automotive (I&A) business for $2.75 billion cash. The transaction includes Silicon Labs' power/isolation, timing and broadcast products, intellectual property, and approximately 350 employees. Silicon Labs said it will focus on its IoT business, which includes integrated hardware and software wireless platforms for multiple ... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive/Mobility With the chip supply so tight it is shutting down automotive production lines, U.S. chip company CEOs signed a Semiconductor Industry Association (SIA) letter asking the U.S. president to include funding incentives for the chip manufacturing in U.S. economic recovery plans. The letter references the CHIPS for America Act and asks the president to work with Congress to suppo... » read more

Week In Review: Manufacturing, Test


The coronavirus (COVID-19) continues to have an impact on most, if not all, industries. This includes the electronics, semiconductor and related segments. International Data Corp. (IDC) has released a report on the company’s view on the impact the COVID-19 virus will have on the semiconductor market. The report provides a framework to evaluate the market impact through four scenarios. "... » read more

Week in Review – IoT, Security, Autos


Products/Services Achronix Semiconductor joined Taiwan Semiconductor Manufacturing’s IP Alliance Program, part of the foundry’s Open Innovation Platform. Achronix’s Speedcore eFPGA IP is available today on TSMC 16nm FinFET Plus (16FF+) and N7 process technologies, and it will be soon available on TSMC 12nm FinFET Compact Technology (12FFC). Cadence Design Systems announced that its di... » read more

Week in Review: IoT, Security, Auto


Internet of Things Forrester Research released its 2019 Internet of Things predictions. Some key points: Bundled service offerings will catalyze a sleepy consumer IoT market; cybercriminals will lay siege to a smart-city implementation; and a market for IoT managed services will emerge in 2019. Black Friday and Cyber Monday are coming up. Those days present some opportunities to purchase ... » read more

The Week in Review: IoT


Tools/Chips Synopsys rolled out a new release of its automotive exterior lighting design and analysis software. The tool calculations and generates images for multiple viewing directions and different lighting conditions. Lighting on vehicles has become far more complex than just shining a beam on the road. The latest technology can adapt to road conditions, other cars, and help illuminate the... » read more

The Week in Review: IoT


Finance Orbbec of Shenzhen, China, a developer of motion sensing technology, raised more than $200 million in Series D funding led by Ant Financial. Also participating in the new round were SAIF Financial, Green Pine Capital Partners, R-Z Capital, and Tianlangxing Capital Partners. Established in 2013, Orbbec develops 3D sensors for applications in facial recognition, gesture recognition, robo... » read more

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