Chip Industry Week In Review

By The SE Staff - 19 Apr, 2024 - Comments: 0

SK hynix and TSMC plan to collaborate on HBM4 development and next-generation packaging technology, with plans to mass produce HBM4 chips in 2026. The agreement is an early indicator for just how competitive, and potentially lucrative, the HBM market is becoming. SK hynix said the collaboration will enable breakthroughs in memory performance with increased density of the memory controller at t... » read more

Chip Industry Week In Review

By The SE Staff - 22 Sep, 2023 - Comments: 0

By Jesse Allen, Karen Heyman, and Liz Allan The U.S. Department of Defense (DOD) announced $238 million in awards toward establishing eight regional innovation hubs under the CHIPS and Science Act. The hubs aim to accelerate hardware prototyping and "lab-to-fab" transition of semiconductor technologies for secure edge/IoT, 5G/6G, AI hardware, quantum technology, electromagnetic warfare, and ... » read more

Research Bits: Jan. 31

By Susan Rambo - 31 Jan, 2023 - Comments: 0

The power of proximity Researchers from Department of Energy’s Lawrence Berkeley National Laboratory (Berkeley Lab), Stanford, and University of California Berkeley have observed that electrons transfer heat rapidly between layers of the 2D semiconductor materials tungsten diselenide (WSe2) and tungsten disulfide (WS2). The electrons acted as a bridge between the two materials, the layers of... » read more

Week In Review: Design, Low Power

By Marie C. Baca - 06 Jan, 2023 - Comments: 0

Top Of The News Google announced it will support the RISC-V architecture with the Android open-source operating system. In a keynote at the RISC-V Summit, Lars Bergstrom, Google's director of engineering for the Android Platform Programming Languages, noted that Android currently has more than 3 billion users and the support of more than 24,000 vendors. "We've been following RISC-V for a very ... » read more

Chip Industry’s Technical Paper Roundup: Nov. 15

By Linda Christensen - 15 Nov, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=63 /] » read more

Energy of Computing As A Key Design Aspect (SLAC/Stanford, MIT)

By Technical Paper Link - 08 Nov, 2022 - Comments: 0

A technical paper titled "Trends in Energy Estimates for Computing in AI/Machine Learning Accelerators, Supercomputers, and Compute-Intensive Applications" was published by researchers at SLAC/Stanford University and MIT. Abstract: "We examine the computational energy requirements of different systems driven by the geometrical scaling law, and increasing use of Artificial Intelligence or Ma... » read more

Week In Review: Manufacturing, Test

By Linda Christensen - 24 Sep, 2021 - Comments: 1

Markets Worldwide semiconductor industry revenue is expected to grow 17.3% in 2021, compared with 10.8% in 2020, according to a new IDC report. Segment breakdown is as follows: [table id=5 /] “Semiconductor wafer prices increased in 1H21 and IDC expects increases to continue for the rest of 2021 due to material costs and opportunity cost in mature process technologies. Overall, IDC pre... » read more

Power/Performance Bits: Dec. 29

By Jesse Allen - 29 Dec, 2020 - Comments: 0

Safer Li-ion batteries Scientists from Stanford University and the Department of Energy's SLAC National Accelerator Laboratory propose a way to make lithium-ion batteries lighter, more efficient, and fire resistant. One of the heaviest components of lithium-ion batteries are the copper or aluminum sheets that act as current collectors. "The current collector has always been considered de... » read more

Manufacturing Bits: Dec. 1

By Mark LaPedus - 01 Dec, 2020 - Comments: 0

New phase-change materials The National Institute of Standards and Technology (NIST) has developed an open source machine learning algorithm for use in discovering and developing new materials. NIST’s technology, called CAMEO, has already been used by researchers to discover a new phase-change memory material. CAMEO, which stands for Closed-Loop Autonomous System for Materials Exploration... » read more

Manufacturing Bits: Nov. 3

By Mark LaPedus - 03 Nov, 2020 - Comments: 0

Zeptosecond measurements A group of researchers have set a new world’s record for the shortest timespan measurement. DESY, Fritz-Haber-Institute and Goethe University Frankfurt have measured how long it takes for a photon to cross a hydrogen molecule. The result? About 247 zeptoseconds. A zeptosecond is a trillionth of a billionth of a second (10-21 seconds). This is said to be the sh... » read more

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tag: SLAC

Chip Industry Week In Review

Chip Industry Week In Review

Research Bits: Jan. 31

Week In Review: Design, Low Power

Chip Industry’s Technical Paper Roundup: Nov. 15

Energy of Computing As A Key Design Aspect (SLAC/Stanford, MIT)

Week In Review: Manufacturing, Test

Power/Performance Bits: Dec. 29

Manufacturing Bits: Dec. 1

Manufacturing Bits: Nov. 3

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