The Week In Review: Manufacturing


R&D Amid budget cuts in the U.S. government, federal funding for R&D at higher education institutions in the United States declined for a fourth straight year, according to a new report from the National Center for Science and Engineering Statistics (NCSES). Overall, universities reported $68.8 billion in R&D expenditures in 2015, a 2.2% increase from 2014, according to the NCSES, part of t... » read more

Changes In China


By Jesse Zhang, SEMI China Industry leaders gathered in Beijing at BIMS 2016 — the Beijing International Microelectronics Symposium — to discuss growth opportunities for the semiconductor industry and the mobile communications market. The 17th session of BIMS was co-sponsored by SEMI and the Chinese-American Semiconductor Professionals Association (CASPA). For 17 years, BIMS has provi... » read more

The Week In Review: Design


M&A Siemens plans to buy Mentor Graphics for $4.5 billion in cash. The move, if approved by regulators, would greatly expand Siemens’ capabilities in multi-physics design and embedded software for everything from semiconductors to automotive wiring harnesses. The transaction is expected to close in the second quarter of 2017. Tools Mentor Graphics uncorked a new product to measur... » read more

The Week In Review: Design


IP ARM unveiled a suite of products focused on the IoT, with new processors, radio technology, subsystems, end-to-end security and a cloud-based services platform. Included are Cortex-M23 and Cortex-M33, the first embedded processors based on the ARMv8-M architecture. The Cortex-M33 features configuration options including a coprocessor interface, DSP and floating point computation, while th... » read more

How Many Nanometers?


What’s the difference between a 10nm and a 7nm chip? That should be a straightforward question. Math, after all, is the only pure science. But as it turns out, the answer is hardly science—even if it is all about numbers. Put in perspective, at 65nm, companies defined the process node by the half pitch of the first metal layer. At 40/45nm, with the cost and difficulty of developing n... » read more

The Week In Review: Manufacturing


Chipmakers Alain Kaloyeros, president of SUNY Polytechnic Institute, has resigned. This comes amid charges that Kaloyeros was involved in an alleged bid-rigging scheme, according to multiple reports. SUNY Poly, a high-tech educational ecosystem in New York, was recently formed from the merger of the SUNY College of Nanoscale Science and Engineering (CNSE) and the SUNY Institute of Technology. ... » read more

The Week In Review: Manufacturing


Numbers IC Insights predicts TowerJazz and SMIC sales will jump this year, with the total pure-play foundry revenue forecast to grow 9%. That compares with 6% growth last year. TSMC is expected to shrink slightly to 58% market share, with GlobalFoundries staying flat at 11%. UMC will remain in third place in the rankings, followed by SMIC and TowerJazz. SEMI’s book-to-bill ratio jumped to... » read more

Getting The Jump On Analog/RF IP


When Magma Design was sold to Synopsys in 2012, then-president and COO Roy Jewell sat down with VC Lucio Lanza to figure out what to do next. As Jewell tells it, Lanza convinced him not to take another job. While it’s too early to tell if that was sage advice, it did trigger a search for a new business and a way of funding it. Jewell said that when Magma went looking for money, it raised $... » read more

Foundry Capacity Investment Led By Taiwan And China


The era of every company building a captive fab for next-generation products is ancient history, as foundries throughout the world provide leading-edge technology and flexible capacity in a timely and cost-effective manner. In today’s mobile-driven ecosystem, faster product development cycles and time-to-market have become the norm for the industry. Now, this trend is even spreading to the co... » read more

The Week In Review: Manufacturing


Fab tools Applied Materials has officially rolled out the Producer Selectra system, a selective etch tool. The system falls under the loosely defined category called atomic layer etch (ALE). Applied’s technology addresses a number of challenges. Today’s advanced chips have complex structures. They may also have deep and narrow trenches. One of the challenges is the inability of wet ... » read more

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