Power Impacts On Advanced Node IP

By Ann Steffora Mutschler With the move to the 28nm or 20nm process nodes, SoC engineering teams are seeing a significant amount of variations due to manufacturability. To reflect how a design element will be printed on the wafer, foundries offer many libraries with multiple corners for different voltages, timing and temperature, among other things. “At 28nm what we are seeing is a l... » read more