First Look: 10nm

As the semiconductor industry begins grappling with mass production at 14/16nm process nodes, work is already underway at 10nm. Tools are qualified, IP is characterized, and the first test chips are being produced. It's still too early for production, of course—perhaps three years too early—but there is enough information being collected to draw at least some impressions about just how toug... » read more

How Reliable Is Your IP?

Almost everyone who has bought a new smartphone, car, home electronics device or appliance either has experienced technical glitches that require a replacement or repair, or they know someone who has experienced these problems. The good news is that only a very small fraction of the electronic glitches or failures can be contributed to hardware design. Most of it is due to manufacturing vari... » read more

Dangerous Electricity

By Ann Steffora Mutschler Electricity to the modern age is as indispensible as air, but too much can be a bad thing for automotive and aerospace applications—especially when it is in the form of electrostatic discharge (ESD). As chips advance to 28nm, 20nm and 16nm, the design window for electrostatic discharge is shrinking for a number of reasons, explained Norman Chang is vice presi... » read more

Why Semiconductor Packaging Matters

By Ann Steffora Mutschler After decades of being considered almost an afterthought, semiconductor packaging is emerging as an integral part of the Moore’s Law road map. Power, heat, manufacturing and impurities like soft errors have become so pronounced at 45nm and 32nm that they are actually beginning affect the package. And while these problems are not new, continual shrinking has made th... » read more