tag: Sondrel

Better Choreography Required For Complex Chips
By Karen Heyman - 22 Jun, 2023 - Comments: 0

The rapidly growing number of features and options in chip design are forcing engineering teams to ratchet up their planning around who does what, when it gets done, and how various components will interact. In effect, more elements in the design flow need to be choreographed much more precisely. Some steps have to shift further left, while others need to be considered earlier in the plannin... » read more

Week In Review: Design, Low Power
By Jesse Allen - 07 Apr, 2023 - Comments: 0

MLCommons debuted the latest results for the MLPerf Inference v3.0 and Mobile v3.0 benchmark suites, which measure the performance and power-efficiency of applying a trained machine learning model to new data in data center, edge, and mobile use cases. Overall, MLCommons said the results showed both power efficiency improvements and significant gains in performance in some benchmark tests. Seve... » read more

Week In Review: Design, Low Power
By Jesse Allen - 10 Mar, 2023 - Comments: 0

Arm is expected to list solely on a U.S. stock exchange when it goes public again later this year, forgoing the London Stock Exchange for now, the BBC reports. Global investment banks expect the offering to value the company between $30 billion and $70 billion, according to Bloomberg. Disaggregating chips into specialized processors, memories, and architectures is becoming necessary for cont... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 06 May, 2022 - Comments: 0

Automotive, mobility Stellantis is buying Share Now, a car sharing service owned by BMW and Mercedes-Benz. Through the acquisition, Stellantis will be adding 3.4 million car sharing customers, 10,000 vehicles, and 14 new European cities to its Free2move car sharing service, which currently has 2 million users, 2,500 vehicles, and has 7 “mobility hubs” in the U.S. and Europe. ShareNow was a... » read more

Week In Review: Design, Low Power
By Jesse Allen - 06 May, 2022 - Comments: 0

Rambus will acquire Hardent, a provider of design services and IP. Rambus said Hardent's silicon design, verification, compression, and Error Correction Code (ECC) expertise will provide key resources for the Rambus CXL Memory Interconnect Initiative. “Driven by the demands of advanced workloads like AI/ML and the move to disaggregated data center architectures, industry momentum for CXL-base... » read more

Week In Review: Design, Low Power
By Jesse Allen - 09 Jul, 2021 - Comments: 0

Tools Aldec extended its TySOM family of embedded prototyping boards with the introduction of TySOM-M-MPFS250, the first in a planned series to feature a Microchip PolarFire SoC FPGA MPFS250T-FCG1152 and to have dual FMC connectivity. The board contains 16Gb FPGA DDR4 x32, 16Gb MSS DDR4 x36 with ECC, eMMC, SPI Flash memory, 64 Kb EEPROM and a microSD card socket. The PolarFire SoC is a five-st... » read more

Week In Review: Design, Low Power
By Jesse Allen - 05 Mar, 2021 - Comments: 0

Tools Synopsys introduced Euclide, a next-generation hardware description language (HDL)-aware integrated development environment (IDE). Euclide aims to enable earlier detection of bugs and optimize code for design and verification flows by identifying complex design and testbench compliance checks during SystemVerilog and UVM development. It assists correct-by-construction code development th... » read more

Week In Review: Design, Low Power
By Jesse Allen - 22 Jan, 2021 - Comments: 0

Cadence will acquire NUMECA International, a provider of computational fluid dynamics (CFD), mesh generation, multi-physics simulation, and optimization solutions for industries including aerospace, automotive, industrial, and marine. “Next-generation products and systems require comprehensive multi-physics engineering solutions encompassing IP, semiconductors, IC packaging, modules, board... » read more

Week In Review: Design, Low Power
By Jesse Allen - 17 May, 2019 - Comments: 0

Tools & IP Cadence introduced the Tensilica Vision Q7 DSP, which provides up to 1.82 TOPS and is specifically optimized for simultaneous localization and mapping (SLAM). The DSP has a very long instruction word (VLIW) SIMD architecture, an enhanced instruction set supporting 8/16/32-bit data types and optional VFPU support for single and half precision, and a number of iDMA enhancements in... » read more

The Week In Review: Design
By Jesse Allen - 04 May, 2018 - Comments: 0

M&A ANSYS finalized its acquisition of OPTIS. Founded in 1989, OPTIS provided software for scientific simulation of light, human vision and physics-based visualization. The acquisition boosts the company's automotive simulation portfolio with radar, lidar and camera simulation. Terms were not disclosed. IP Arm debuted the Cortex-M35P processor. Aimed at IoT applications, the IP combine... » read more

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