tag: Sony

Where All The Semiconductor Investments Are Going
By Ed Sperling - 17 Nov, 2022 - Comments: 2

Companies and countries are funneling huge sums of money into semiconductor manufacturing, materials, and research — at least a half-trillion dollars over the next decade, and maybe much more — to guarantee a steady supply of chips and know-how to support growth across a wide swath of increasingly data-centric industries. The build-out of a duplicate supply chain that can guarantee capac... » read more

SiPs: The Best Things in Small Packages
By Laura Peters - 20 Oct, 2022 - Comments: 0

System-in-package (SiP) is quickly emerging as the package option of choice for a growing number of applications and markets, setting off a frenzy of activity around new materials, methodologies, and processes. SiP is an essential packaging platform that integrates multiple functionalities onto a single substrate, which enables lower system cost, design flexibility, and superior electrical p... » read more

Week In Review: Auto, Security, Pervasive Computing
By Marie C. Baca - 14 Oct, 2022 - Comments: 0

Automotive, Mobility Hyundai announced all of its vehicles will be software-defined vehicles (SDVs) by 2025. The company said all newly launched Hyundai vehicles will be able to receive over-the-air software updates next year, and that it expects to register 20 million vehicles to its Connected Car Services system by 2025. Hyundai also said it will invest the equivalent of more than $12 billio... » read more

Hybrid Bonding Moves Into The Fast Lane
By Laura Peters - 21 Jul, 2022 - Comments: 1

The industry’s unquenchable thirst for I/O density and faster connections between chips, particularly logic and cache memory, is transforming system designs to include 3D architectures, and hybrid bonding has become an essential component in that equation. Hybrid bonding involves die-to-wafer or wafer-to-wafer connection of copper pads that carry power and signals and the surrounding diele... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 04 Mar, 2022 - Comments: 0

From pandemic to war — some of the news this week highlights reactions to Russia’s invasion of Ukraine. Pervasive computing, IoT, 5G and beyond SpaceX sent Starlink satellite dishes to Ukraine to enable Ukrainian access to the Internet. The caveat is the uplink signals from satellite equipment can be used to triangulate the position of the dish, which can then be hit by missile. The dis... » read more

A Broad Look Inside Advanced Packaging
By Mark LaPedus - 18 Nov, 2021 - Comments: 0

Choon Lee, chief technology officer of JCET, sat down with Semiconductor Engineering to talk about the semiconductor market, Moore’s Law, chiplets, fan-out packaging, and manufacturing issues. What follows are excerpts of that discussion. SE: Where are we in the semiconductor cycle right now? Lee: If you look at 2020, it was around 10% growth in the overall semiconductor industry. ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 12 Nov, 2021 - Comments: 0

Chipmakers AMD has rolled out its new MI200 series products, the first exascale-class GPU accelerators. Using a fan-out bridge packaging technology, the MI200 series are designed for high-performance computing (HPC) and artificial intelligence (AI) applications. The MI200 series accelerators feature a multi-die GPU architecture with 128GB of HBM2e memory. Typically, the HBM2e memory stack a... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 15 Oct, 2021 - Comments: 0

Chipmakers TSMC posted its results for the quarter and confirmed its long-awaited plans to build a fab in Japan. It’s not a leading-edge fab, but rather a plant for 28nm/22nm processes. “The company confirmed plans to build a new fab in Japan for 22nm + 28nm,” said Aaron Rakers, an analyst at Wells Fargo, in a research note. “An average 22/28nm fab costs ~$4-5B range per 45k wspm. Fab ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 01 Oct, 2021 - Comments: 0

Valens Semiconductor began trading on the New York Stock Exchange as VLN after a merger with special-purpose acquisition company (SPAC) PTK Acquisition Corp. Valens offers high-speed connectivity chips for the audio-video and automotive markets, including its HDBaseT technology for connectivity between ultra-HD video sources and remote displays and its in-vehicle high-speed links. The transacti... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 01 Oct, 2021 - Comments: 0

Automotive GM’s self-driving car Cruise and Alphabet’s Waymo have won permits to offer rides to passengers in California. Ford Motor Company announced it is expanding its electric pickup truck assembly lines. With SK Innovation, Ford will create a 3,600-acre mega campus in west Tennessee to produce electric trucks. The company estimates the campus will add 6,000 new jobs to the economy.... » read more

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