SEMICON Taiwan’s Packaging Punch


SEMICON Taiwan packed a punch, setting several new records and new heights in 2015. This year marked the 20th anniversary of SEMICON in Taiwan and was the largest SEMICON in Taiwan ever, with a Nobel Prize winner (Professor Shuji Nakamura, 2014’s winner) keynoting the Executive Summit, Taiwan’s President Ma speaking at the hugely attended Gala Dinner, and 2015 on track for TSMC to be the wo... » read more

The Week In Review: Manufacturing


Intel and Royal Caribbean International teamed up to integrate Intel-powered tablets onboard the Quantum of the Seas, the world’s first “smartship.” Royal Caribbean is installing 15,000 Intel-based Dell Venue tablets at point-of-sale locations on the new ship. When will Applied Materials’ proposed acquisition of Tokyo Electron Ltd. (TEL) happen? “Timing-wise we still think that it ... » read more

The Week In Review: Manufacturing


Has extreme ultraviolet (EUV) lithography finally turned the corner after numerous delays and setbacks? The big test for EUV could reside at TSMC. “TSMC ordered two new EUV tools (from ASML), and is expected to use four EUV tools in total (with the two new orders) for its 10nm process (likely one layer, ramping in 2016 or 2017). EUV remains far from ready for broad adoption, in our view, but ... » read more

The Week In Review: Manufacturing


Many are suffering from “fragiphoniphobia” without even realizing it, according to Kyocera. This is the fear of fragile phones and worries about the drops and spills ruining our smartphones and disrupting our lives. A recent survey from comScore revealed that 73% of consumers surveyed rated drop protection or scratch-proof/shatter-proof screens as the most desirable durability feature, whil... » read more

Manufacturing Bits: July 15


Multi-beam hits milestone Mapper Lithography has reached a major milestone in its ongoing push to bring multi-beam, direct-write lithography into the mainstream. The Dutch-based company recently installed its initial pre-production tool at CEA-Leti, a French-based R&D organization. The tool, dubbed Matrix 1.1, is a multi-beam, e-beam system for direct-write applications. During the r... » read more

The Week In Review: Manufacturing


As feature sizes continue to shrink and new device architectures are introduced, the IC industry will require new breakthroughs. In fact, feature dimensions will soon have tolerances that are on the order of a few atoms. For the most advanced structures, conventional plasma etch and deposition processes are unable to meet these requirements. As a result, the industry will require tools th... » read more