HBM3: Big Impact On Chip Design


An insatiable demand for bandwidth in everything from high-performance computing to AI training, gaming, and automotive applications is fueling the development of the next generation of high-bandwidth memory. HBM3 will bring a 2X bump in bandwidth and capacity per stack, as well as some other benefits. What was once considered a "slow and wide" memory technology to reduce signal traffic dela... » read more

Auto Power Becoming Much More Complex


Rising electronics content in automobiles is putting increased focus on automotive power delivery networks (PDNs). Safety implications mean that thorough power design and verification, along with novel power isolation techniques, are needed at the vehicle level, involving both electrical and mechanical considerations. The electronic takeover can be measured by the percentage that electronic ... » read more

Week in Review: IoT, Security, Autos


Products/Services Siemens announced that Mazda Motor adopted the Capital electrical design software suite from Mentor, a Siemens Business, for the design of next-generation automotive electrical systems. Mazda is said to use Capital for model-based generative design for the electrical and electronic systems of the entire vehicle platform. Synopsys will host the 11th annual Codenomi-con USA ... » read more

Plotting The Next Semiconductor Road Map


The semiconductor industry is retrenching around new technologies and markets as Moore's Law becomes harder to sustain and growth rates in smart phones continue to flatten. In the past, it was a sure bet that pushing to the next process node would provide improvements in power, performance and cost. But after 22nm, the economics change due to the need for multi-patterning and finFETs, and th... » read more