The Week In Review: Manufacturing


Packaging and test A*STAR’s Institute of Microelectronics (IME) has formed a fan-out wafer-level packaging consortium comprising of OSATs, materials vendors, equipment suppliers and others. The group is called the FOWLP Development Line Consortium. As part of the announcement, Singapore’s IME has established a development line to accelerate the development of fan-out. Located in IME’s... » read more

Litho Options For Panel Fan-out


Several packaging houses are inching closer to production of panel-level fan-out packaging, a next-generation technology that promises to reduce the cost of today’s fan-out packages. In fact, ASE, Nepes, Samsung and others already have installed the equipment in their panel-level fan-out lines with production slated for 2018 or so. But behind the scenes, panel-level packaging houses contin... » read more

Challenges And Improvement Of Reliability In Advanced Wafer Level Packaging Technology


The number of WLCSP (wafer-level packages) used in semiconductor packaging has experienced significant growth since its introduction in 1998. The growth has been driven primarily by mobile consumer products because of the small form factor and high performance enabled in the package design. And it is also attractive to wearable electronics and IoT products. Although WLCSSP is now a widely ac... » read more

New Power Concerns At 10/7nm


As chip sizes and complexity continues to grow exponentially at 7nm and below, managing power is becoming much more difficult. There are a number of factors that come into play at advanced nodes, including more and different types of processors, more chip-package decisions, and more susceptibility to noise of all sorts due to thinner insulation layers and wires. The result is that engineers ... » read more

Toward System-Level Test


The push toward more complex integration in chips, advanced packaging, and the use of those chips for new applications is turning the test world upside down. Most people think of test as a single operation that is performed during manufacturing. In reality it is a portfolio of separate operations, and the number of tests required is growing as designs become more heterogeneous and as they ar... » read more

Reliability Of eWLB For Automotive Radar Applications


With shrinking of chip sizes, Wafer Level Chip Scale Packaging (WLCSP) becomes an attractive and holistic packaging solutions with various advantages in comparison to conventional packages, such as Ball Grid Array (BGA) with flipchip or wirebonding. With the advancement of various fan-out (FO) WLPs, it has been proven to be a more optimal, low cost, integrated and reliable solution compared to ... » read more

Integrated Passives Market Gets Active


Integrated passive devices are seeing greater use within system-in-package technology and numerous applications, including the Internet of Things. The tiny devices are making their way into automotive electronics, consumer electronics, and health-care products, among other uses. Europe is leading the way in supplying IPDs, thanks to offerings from Infineon Technologies, STMicroelectronics, a... » read more

Advanced Packaging’s Progress


Shim Il Kwon, CTO at STATS ChipPAC, sat down with Semiconductor Engineering to discuss the current and future trends of chip packaging. What follows are excerpts of that conversation. SE: The outsourced semiconductor assembly and test (OSAT) vendors provide third-party IC-packaging and test services. What are the big challenges for OSATs today? Shim: The OSAT market is very competitive, w... » read more

Advanced Packaging For Automotive Dashboard Application


The current automotive market for the IC (integrated circuit) packaging industry has grown significantly due to the increasing need for automation and higher performance in vehicles. These changes in the automotive market will enable cars to be more reliable and intelligent. To address the increasingly complex demands of the automotive market, the semiconductor packaging industry is shifting it... » read more

Get Ready For In-Mold Electronics


Imagine inserting the electronics into a product without using a printed circuit board, a module, or even a system-in-package. That's the promise of in-mold electronics (IME), a technology that has been around for years, but which is just beginning to see wider adoption. The technology is related to conductive inks and transparent conductive films. The IME manufacturing process is said to pr... » read more

← Older posts