Embedded Die Packaging Emerges


Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete in the merchant embedded die packaging market, according to Yole Développement. In fact, ASE and TDK have a joint venture in the arena, which is beginning to ramp up production. Additional... » read more

The Week In Review: Manufacturing


Fab tools Samsung Electronics has broken ground on a new extreme ultraviolet (EUV) lithography facility in Hwaseong, South Korea. The new EUV facility is expected to be completed within the second half of 2019 with production slated for 2020. The initial investment in the new EUV line is projected to reach $6 billion by 2020. Imec and Cadence Design Systems have collaborated on the develop... » read more

The Week in Review: IoT


Finance CyberX raised $18 million in Series B funding, bringing its total funding to $30 million. Norwest Venture Partners led the new round and was joined by ff Venture Capital, Flint Capital, Glilot Capital Partners, and OurCrowd. CyberX makes its headquarters in Framingham, Mass., with operations in Israel. The startup offers security protection for Industrial Internet of Things application... » read more

IoT’s Many Different Forms


The Internet of Things is settling into widespread industrial applications, along with precision agriculture, while consumer IoT continues to find its way into the home through smart speakers and their digital assistants, such as Amazon Echo, Apple HomeKit, and Google Home. The Internet of Cows and the Internet of Tomatoes may sound like fanciful subjects, yet there is serious technology in ... » read more

What’s Up With MEMS?


New sensor technologies, and smarter ways of integrating more intelligence, continue to generate unexpected opportunities in the changing MEMS business. Changes needed for sensors for context awareness If digital assistants are ever going to be really useful, they’ll need some particular sensor capabilities to understand emotion, suggests Lama Nachman, head of Intel’s Anticipatory Compu... » read more

MEMS Market Shifting


The MEMS sector is beginning to look more promising, bolstered by new end-market demand and different packaging options that require more advanced engineering, processes and new materials. All of this points to higher selling prices, which are long overdue in this space. For years, the market for microelectromechanical systems was populated by too many companies vying for too few opportunit... » read more

The Week In Review: IoT


Analysis Whither Intel’s Internet of Things efforts? “While Intel's IoT business certainly won't solve its ongoing troubles in the PC and data center markets anytime soon, staying invested in that market will ensure that the chipmaker doesn't miss another major technological shift, as it did with mobile devices about a decade ago,” Leo Sun writes in this analysis. Products Cisco Sys... » read more

Looking Back On IoT In 2016


The Internet of Things was going great guns for most of 2016. Until October 21, that is. That’s the date of the coordinated cyberattacks on Dyn, an Internet performance management services firm. The distributed denial-of-service attacks quickly had impacts on Airbnb, Amazon, Facebook, Netflix, PayPal, Reddit, Twitter, and other popular websites. Dyn was able to fight off the aggressive att... » read more

The Week In Review: Manufacturing


Chipmakers TDK has agreed to acquire MEMS supplier InvenSense for cash at an acquisition price of $13.00 per share, for a total acquisition price of $1.3 billion. Cypress has begun volume shipments of microcontrollers (MCUs) based on its 40nm Embedded Charge-Trap (eCT) flash technology. The MCUs are made on a foundry basis at UMC. UMC’s technology is a 40nm low power (40LP) logic process.... » read more

The Week In Review: IoT


M&A TDK has agreed to acquire InvenSense for $13 a share, representing a total of $1.3 billion in cash. The transaction must be approved by InvenSense shareholders and regulatory agencies; TDK expects to wrap up the deal in the second quarter of its fiscal year ending in March of 2018 (the third quarter of the calendar year). Apple accounted for 40% of InvenSense’s revenue for the fiscal... » read more

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