Manufacturing Bits: April 19

Hot videos The University of Minnesota has recorded videos that show how heat travels through materials, a move that could give researchers insight into the behavior of atoms and other structures. It could also pave the way towards the development of more efficient materials for use in electronics and other applications. In the lab, researchers used FEI’s transmission electron microsc... » read more

Manufacturing Bits: July 21

Graphene metrology Harvard University, Monash University and the U.S. Department of Energy’s Lawrence Berkeley National Laboratory have developed a new technique that provides atomic-scale images of colloidal nanoparticles. The technique, dubbed SINGLE, stands for 3D Structure Identification of Nanoparticles by Graphene Liquid Cell Electron Microscopy. Using the technology, researchers ha... » read more

Searching For 3D Metrology

In the previous decade, chipmakers made a bold but necessary decision to select the [getkc id="185" kc_name="finFET"] as the next transistor architecture for the IC industry. Over time, though, chipmakers discovered that the finFET would present some challenges in the fab. Deposition, etch and lithography were the obvious hurdles, but chipmakers also saw a big gap in metrology. In fact,... » read more

Manufacturing Bits: Feb. 24

EUV progress report At the SPIE Advanced Lithography conference in San Jose, Calif., ASML Holding said that one customer, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), has exposed more than 1,000 wafers on an NXE:3300B EUV system in a single day. This is one step towards the insertion of EUV lithography in volume production. During a recent test run on the system, TSMC exposed 1,022 w... » read more