Saving Energy In The Fab


It’s not an exaggeration to say that integrated circuits are a critical component of any effort to reduce global carbon dioxide emissions. The most efficient engines depend on microcontrollers to optimize fuel consumption. Global shipping uses sophisticated simulators for load balancing and route planning. Computing power that once needed room-sized cooling units now fits in a battery-powered... » read more

Emulation’s Footprint Grows


It wasn't that many years ago that [getkc id="30" comment="emulation"] was an expensive tool available to only a few, but it has since become indispensable for a growing number of companies. One obvious reason is the growing size of designs and the inability of [getkc id="11" kc_name="simulation"] to keep up. But emulation also has been going through a number of transformations that have made i... » read more

Gaps Emerge In Test Flows


Gaps are showing up in test flows as chipmakers add more analog content and push into more safety-critical applications, exposing more points at which designs need to be tested as well as weaknesses in current tools and methodologies. The cornerstone of the [getkc id="76" kc_name="IoT"], and connected devices such as self-driving cars, is a heavy reliance on [getkc id="187" kc_name="sensors"... » read more

Rethinking The Sensor


Sensor technology is beginning to change on a fundamental level as companies begin looking beyond a human’s five senses, on which early sensors were modeled, to what can be done with those sensors for specific applications. In some cases, [getkc id="187" kc_name="sensors"] don’t have to be as accurate as the sight, smell, touch, taste and hearing of a person. In others, they can be a... » read more

The Week in Review: IoT


Deals Samsung said Tuesday that it will invest about $1.2 billion in Internet of Things startups in the U.S. over the next four years. Investments will be made through the Samsung Global Innovation Center in Silicon Valley and through other Samsung units. Samsung is partnering with Intel to establish the National IoT Strategy Initiative, which will take in academic and industry members and wil... » read more

The Week In Review: Manufacturing


Chipmakers Through a joint venture with the government of Chongqing, GlobalFoundries will take over an existing 200mm fab in China. Then, GlobalFoundries plans to retrofit the facility and turn it into a 300mm fab. The foundry vendor is transferring its 180nm and 130nm processes to the China fab. Meanwhile, TSMC, UMC and others are also building fabs in China. Samsung Electronics has begu... » read more

IC Industry Waking Up To Security


By Jeff Dorsch & Ed Sperling Many people pay lip service to the concept of security in Internet of Things devices, software, and networks. That oversight is beginning to fade away, however, as companies begin digging into one of the broadest and most complex problems in the IoT age. Unlike other technology issues, which have been solved in increments, security is all-inclusive. While ... » read more

The Mightier Microcontroller


Microcontrollers are becoming more complex, more powerful, and significantly more useful, but those improvements come with strings attached. While it's relatively straightforward to develop multi-core microcontroller (MCU) hardware with advanced power management features, it's much more difficult to write software for these chips because memory is limited. CPUs can use on-chip memory such as... » read more

Tech Talk: ADAS


Kurt Shuler, vice president of marketing at Arteris, explains what the Advanced Driver Assistance Systems standard is, where the problems are, and why this is becoming so important in automotive semiconductor design. [youtube vid=w2zZUV0RdjI] » read more

3D Construction Ahead


One of the interesting features of Photonics West is that it covers the full spectrum, from academic research to industrial research to new products in the commercial exhibits. This range of interrelated ideas was on show in 3D fabrication. At one extreme, the latest research in scanning multi-spot three-photon patterning showed 3D structures 100μm thick with 50nm features. Researchers als... » read more

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