Hardware-In-The-Loop Simulation, Testing


Embedded electronics are showing up nearly everywhere these days, in cars, smart appliances, medical devices—even fighter jets. Making sure those real-time embedded systems will work correctly is the aim of hardware-in-the-loop simulation and testing, which puts the systems through their paces in a virtual environment. In effect, HIL simulation adds a mathematical representation of all fun... » read more

New Market Expectations For 2015


This year more than 26 people provided predictions for 2015. Most of these came from the EDA industry, so the results may be rather biased. However, ecosystems are coming closer together in many parts of the semiconductor food chain, meaning that the EDA companies often can see what is happening in dependent industries and in the system design houses. Thus their predictions may have already res... » read more

Tools And Flows In 2015


This year more than 26 people provided predictions for 2015. Most of these came from the EDA industry, so the results may be rather biased. However, ecosystems are coming closer together in many parts of the semiconductor food chain, meaning that the EDA companies often can see what is happening in dependent industries and in the system design houses. Thus their predictions may have already res... » read more

What Will Change In Design For 2015?


This year more than 26 people provided predictions for 2015. Most of these came from the EDA industry, so the results may be rather biased. However, ecosystems are coming closer together in many parts of the semiconductor food chain, meaning that the EDA companies often can see what is happening in dependent industries and in the system design houses. Thus their predictions may have already res... » read more

Industry Scorecard For 2014


At the end of last year, Semiconductor Engineering asked the industry about the developments they expected to see in 2014. If you care to refresh your memory, they were categorized under markets, semiconductors and development tools. Now it is time to look back and see how accurate those predictions were and where they fell short. Part one addressed the market and semiconductor areas and in thi... » read more

Kicking Off DAC 2015


The DAC executive committee closed the 51st DAC last Friday. And guess what? Right afterward we had the first planning meeting for next year’s conference, for which I’ll serve as General Chair. Because most attendees don’t really get a glimpse behind the curtain into these sorts of activities, I thought I’d experiment by blogging my way to next June in San Francisco. I plan to publis... » read more

The Road Ahead For 2014: Tools


In the third and final part of this predictions series we see the natural conclusion of market shifts that are driving changes in semiconductors, and which in turn drive the tools and IP needed to create those systems. To be expected, the changes fall into a few areas: New tools, techniques and changes required for smaller geometries; A migration to higher-levels of abstraction and the... » read more

The Road Ahead For 2014


Semiconductor Engineering asked several thought leaders in the industry about the market drivers that are affecting their product planning operations for 2014. While almost everyone sees mobile devices continuing to be the major driver during 2014, there are some emerging areas that may start to have a larger impact. This article takes a look at some of those and the impacts they could have on ... » read more

More EMI Mitigation


With electromagnetic interference a major design challenge today in any product that sends or receives a signal, determining how to lessen the impact of this phenomenon was addressed to a large extent in my article, “EMI Cuts a Wide Swath,” but there are a few additional techniques that are important to highlight. Erick Olsen, marketing director at NXP explained that higher performance c... » read more

Verification As A Deterrent?


By Ed Sperling Verification is becoming more than a bottleneck in semiconductor design. It’s actually deterring companies from adopting the latest techniques for saving power or building certain features into chips. The problem is one of complexity, and it’s getting worse at every node. While the tools exist to do complex designs, there are the classic tradeoffs of area, power and per... » read more

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