EVs Raise Energy, Power, And Thermal IC Design Challenges


The transition to electric vehicles is putting pressure on power grids to produce more energy and on vehicles to use that energy much more efficiently, creating a gargantuan set of challenges that will affect every segment of the automotive world, the infrastructure that supports it, and the chips that are required to make all of this work. From a semiconductor standpoint, improvements in th... » read more

Baum: Finding SoC Power Flaws


A South Korean startup founded by a Samsung engineer-turned-researcher has created a tool that finds power design flaws early in the SoC design process. The startup, Baum, Inc., launched the second version of its power-modeling solution in June at DAC. The product is a power design-verification tool that uses high-level models to create analyses designed to spot design flaws that could creat... » read more

Fostering Thermal Design Innovation Using Chip-Package-System Analysis Techniques


As devices continue to become smaller and more portable Moore’s Law continues to increase the number of transistors that fit within a chip albeit many predict an end to this in the near future. However new interconnect technologies that use Through-Silicon-Vias (TSVs) can place ICs next to each other using 2.5D Interposers or stack chips in 3D resulting in even greater system scaling. This co... » read more

Too Hot To Handle


By Ann Steffora Mutschler It used to be that a device could be designed to a thermal design power. The worst case power scenario would be imagined, and the device would be designed with that in mind. But those good old days are gone. Especially for consumer devices, how a device is going to behave with respect to time, or how people are going to use it, must be understood as completely a... » read more