tag: thermal signoff

Technologies For Power, Signal, Thermal, And EMI Sign-Off

By Various Writers - 09 May, 2013 - Comments: 0

This paper discusses the challenges associated with designing smaller, faster, and lower cost products. It provides an overview of Apache's power and noise solutions and how these products enable comprehensive chip-package-system convergence flow across multiple design disciplines. To download this white paper, click here. » read more

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