3D Thermal Simulation Of Resistive Heating


Joule heating, also known as resistive or Ohmic heating, is the power lost to heat as electrical current flows down a conductor. We were introduced to Joule’s first law (Power dissipation = I²R, VI, V²/R) way back in high school. From an electronics thermal simulation perspective it requires a full 3D electrical flow simulation to be conducted, and from that the Joule heating power dissipat... » read more

How To Get The Most Power While Being Cool To The Touch


Traditional electronics thermal management in high power applications such as telecommunication, networking, and computing involves keeping the operating junction temperatures at, or below, maximum rated values for the intended application, often with fans, blowers, heatsinks, etc. Mobile consumer electronics also have to be thermally managed to ensure that when a person uses the product, ‘to... » read more

Calibrating Electronics Thermal Simulation Models


‘Rubbish In, Rubbish Out’ is a common and well-accepted fact in the world of thermal simulation—actually any type of simulation, for that matter. Regardless of the technical capabilities of your thermal simulation tool, the accuracy of prediction will always be tightly coupled to the accuracy of the input data. In terms of electronics thermal simulation, the prediction of the internal ... » read more

Heat Problems Grow With FinFETs, 3D-ICs


From high-end consumer devices to rack-mounted arrays inside of data centers, thermal issues are becoming more serious—and getting much more attention. Driving this shift is the move from single chips to 3D ICs, whether they are interposer-based or stacked die. It’s a well-understood challenge: Die stacking can cause thermal issues because of the lack of a readily accessible thermal diss... » read more