Automotive IC Design Drives Simulation Innovation

By Roberto Stella, STMicroelectronics and Ahmed Eisawy, Mentor Graphics STMicroelectronics invented the Bipolar, CMOS, DMOS (BCD) technology for the intelligent power applications demanded by automotive ICs. This technology is widely-adopted by the automotive IC industry. But, designing automotive ICs is very challenging. It requires innovative techniques to ensure that the ICs can stand u... » read more

Confronting Design Challenges With Smaller Thermal Envelopes

For design engineers, physics giveth but physics can also taketh away. Consider leading-edge smartphones. Outside the improved performance that each generation gives consumers, the handsets themselves get thinner, sleeker, lighter. The reduction in the Z height is effectively a given with each new generation. In 2010, the HTC Nexus One was 11.5mm thick; this year, the Mate 8 is 7.9mm. Rem... » read more

Energy-Efficient Design Helps Autonomous Vehicles Take Off

A new flight endurance record was set recently by the Predator B/MQ-9 Reaper Big Wing experimental drone, traveling 37 hours non-stop, and setting the bar for the next stage of autonomous flight development. The growth of drone technology and their autonomous capabilities for surveillance, security, and reconnaissance has grown rapidly over the past several years, thanks to ever-increasing perf... » read more

Electrical-Mechanical Tool Flow Revisited

For many years, the design tool industry has entertained the idea of combining both electrical and mechanical design into a single user experience, with a single database as a foundation. Major tool vendors, at least on the electrical side, have taken the matter seriously and confirm that activities towards a single flow have been considered, particularly as the [getkc id="7" kc_name="EDA"] ... » read more

TSVs: Copper, Silicon, And CTE Mismatch

As previous articles in this series have discussed, advanced packages introduce new materials and new reliability concerns. Diffusion into solder bumps can create brittle, high resistance, intermetallic compounds. Heat transfer through an interposer can degrade the lifetime of even cool, low power chips. Still, through-silicon vias are unique in that they cut directly through the integrated cir... » read more

Tech Talk: Power Signoff

Ansys' Aveek Sarkar the challenges of power signoff at advanced process nodes, the impact of over-design, and what's necessary for sufficient coverage. [youtube vid=VQoT2KYW-AM] » read more

What I Learned About Heatsinks Using Thermal Simulation

By Yousaf Mohammed, Student Intern at Mentor Graphics When designing electronics, heat dissipated to the surroundings by micro devices is an important consideration because heat has a powerful and stringent effect on their operation and lifespan.  When an electronic device overheats, components start to wear out more quickly, degrade, cross the threshold into safe mode, and then stop functi... » read more

Power/Performance Bits: May 17

Shrinking perovskites Researchers from Imperial College London, Oxford University, Diamond Light Source, Pohang University of Science and Technology in Korea, and Rutgers University have discovered a material that can be chemically tailored to either expand or contract in a precise way and over a wide temperature range. This could lead to new composite materials that do not expand when heate... » read more

Power Management Heats Up

Power management has been talked about a lot recently, especially when it comes to mobile devices. But power is only a part of the issue—and perhaps not even the most important part. Heat is the ultimate limiter. If you cannot comfortably place the device on your face or wrist, then you will not have a successful product. Controlling heat, at the micro and macro levels, is an important asp... » read more

Will 3D-IC Work?

Advanced packaging is becoming real on every level, from fan-outs to advanced fan-outs, 2.5D, and 3D-ICs for memory. But just how far 3D and monolithic 3D will go isn't clear at this point. The reason is almost entirely due to heat. In a speech at SEMI's Integrated Strategy Symposium in January, Babek Sabi, Intel corporate VP and director of assembly and test technology development, warned t... » read more

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