tag: TI

GaN ICs Wanted for Power, EV Markets
By Katherine Derbyshire - 17 Mar, 2022 - Comments: 0

Circuits built with discrete GaN components may get the job done, but fully integrated GaN circuits remain the ultimate goal because they would offer many of the same advantages as integrated silicon circuits. These benefits include lower cost as the circuit footprint is scaled, and reduced parasitic resistance and capacitance with shorter interconnect runs. In addition, improved device perf... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 04 Feb, 2022 - Comments: 2

Government policy The Government of Quebec and IBM have announced a new partnership to establish Quebec as a technology hub in the development of quantum computing, artificial intelligence, semiconductors and high-performance computing. The two entities have formed the Quebec-IBM Discovery Accelerator. The new technology hub aims to focus on developing new projects, collaborations, and skills-... » read more

Industry Transforming In Ways Previously Unimaginable
By Brian Bailey - 30 Dec, 2021 - Comments: 0

Early in the year, everyone expected that the availability of COVID vaccines would signal the start of a return to normal, but that has certainly not been the case. Now the industry is taking a longer-term view about how to transform business, what is necessary for people to maintain their mental health, and how to create robust hybrid work environments for the future that do not discard the po... » read more

Innovations In Sensor Technology
By John Koon - 09 Dec, 2021 - Comments: 0

Sensors are the “eyes” and “ears” of processors, co-processors, and computing modules. They come in all shapes, forms, and functions, and they are being deployed in a rapidly growing number of applications — from edge computing and IoT, to smart cities, smart manufacturing, hospitals, industrial, machine learning, and automotive. Each of these use cases relies on chips to capture d... » read more

Coping With Parallel Test Site-to-Site Variation
By Anne Meixner - 09 Nov, 2021 - Comments: 1

Testing multiple devices in parallel using the same ATE results in reduced test time and lower costs, but it requires engineering finesse to make it so. Minimizing test measurement variation for each device under test (DUT) is a multi-physics problem, and it's one that is becoming more essential to resolve at each new process node and in multi-chip packages. It requires synchronization of el... » read more

Chip Shortages Grow For Mature Nodes
By Mark LaPedus - 22 Jul, 2021 - Comments: 0

The current wave of chip shortages is expected to last for the foreseeable future, particularly for a growing list of critical devices produced in mature process nodes. Chips manufactured at mature nodes typically fall under the radar, but they are used in nearly every electronic device, including appliances, cars, computers, displays, industrial equipment, smartphones, and TVs. Many of thes... » read more

Massive IoT Interop Fuels Protocol Battle
By Bryon Moyer - 15 Jul, 2021 - Comments: 0

Wireless standards are plentiful, but most are not capable of being scaled to the level of a smart city. As a result, such networks have been built application-by-application using proprietary stacks, often with non-interoperable network layers. That, in turn, has slowed the proliferation of dense wireless connectivity at scale. “In a hyper-connected world, connectivity choices are driv... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 02 Jul, 2021 - Comments: 0

Chipmakers and OEMs More delays and product woes at Intel. “INTC disclosed that it is delaying the launch of its next-generation Xeon server processor Sapphire Rapids (10nm) from the end of this year to 1Q22 due to additional validation needed for the chip,” said John Vinh, an analyst at KeyBanc, in a research note. “Production is expected to begin in 1Q22, with the ramp expected to begi... » read more

More Fabs Seen In Chip Boom
By Mark LaPedus - 17 Jun, 2021 - Comments: 0

Over the last year, the semiconductor industry has seen an amazing turnaround. The industry happens to be in a boom cycle. Today, chip demand remains strong. And some fab projects have been accelerated to meet this demand, according to Christian Dieseldorff, an analyst at SEMI. It wasn’t always this way. In early 2020, the business looked bright, but the IC market dropped amid the Covid... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 11 Jun, 2021 - Comments: 0

Chipmakers SiFive has received a takeover offer from Intel, according to a report from Bloomberg. The asking price is more than $2 billion. ------------------------------------------------------------------ IBM has filed suit against GlobalFoundries (GF), alleging fraud and breach of contract committed by GF. IBM’s suit, filed in the Supreme Court of the state of New York, seeks relief... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy